论坛首发Springer2009 Materials for Advanced Packaging

analogmind · 发表于 2010-4-5 22:12:54

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http://www.amazon.com/Materials-Advanced-Packaging-Daniel-Lu/dp/0387782184/ref=sr_1_1?ie=UTF8&s=books&qid=1270475561&sr=1-1

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

随着工作频率的提高singal intergrity 和power integrity 越来越成为设计中不可忽略得因素。而package效应也逐步成为IC设计者在芯片设计初期就要必须重视的一个限制条件。对package的深入理解能有助于我们对信号在具体的传输过程中会遇到什么样的非理想情况有个大致的估计。这对于一个高质量的设计是必须的，希望大家喜欢。

analogmind · 发表于 2010-4-5 22:14:05

自己顶一个先

drjiachen · 发表于 2010-4-5 22:47:27

不错的书籍
做高级封装的可以看看
这本3个月前就有了

apteye · 发表于 2010-4-6 00:00:02

thanks

gonethewind · 发表于 2010-4-6 07:49:36

http://www.amazon.com/Materials-Advanced-Packaging-Daniel-Lu/dp/0387782184/ref=sr_1_1?ie=UTF8&s=books&qid=1270475561&sr=1-1

Significant progress has been made in advanced packaging in recent years. ...
analogmind 发表于 2010-4-5 22:12

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很不错的资料