PROCESSOR DESIGN IN 3D DIE-STACKING TECHNOLOGIES

jimxiao · 发表于 2009-6-9 15:28:32

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THREE-DIMENSIONAL DIE-STACKING INTEGRATION STACKS MULTIPLE LAYERS OF
PROCESSED SILICON WITH A VERY HIGH-DENSITY, LOW-LATENCY LAYER-TO-LAYER
INTERCONNECT. AFTER PRESENTING A BRIEF BACKGROUND ON 3D DIE-STACKING
TECHNOLOGY, THIS ARTICLE GIVES MULTIPLE CASE STUDIES ON DIFFERENT APPROACHES
FOR IMPLEMENTING SINGLE-CORE AND MULTICORE 3D PROCESSORS AND DISCUSSES
HOW TO DESIGN FUTURE MICROPROCESSORS GIVEN THIS EMERGING TECHNOLOGY.

IEEE-Micro-2007.pdf (1.95 MB , 下载次数: 62 )

zhaiqiangzhi · 发表于 2009-6-9 16:21:26

看看什么东西啊

zt0504004 · 发表于 2010-3-9 15:41:42

报告要用的东西

cschiu · 发表于 2010-3-13 14:24:38

论文呼??下來看看

casime-cr · 发表于 2010-5-15 14:59:17

THANKS

truviet911 · 发表于 2011-2-19 07:03:18

nice share. thanks

sslin2 · 发表于 2012-3-22 17:39:57

nice share. thanks

nihaoya · 发表于 2015-1-18 11:50:51

it is a nice book

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