Investigating packaging effects on bandgap references

kenlino

Investigating packaging effects on bandgap references

Author:

Palakodety, Ravi (Ravi Kiran)

Advisor:

Tick Houk and Charles Sodini.

Abstract:


This thesis investigates packaging effects on precision bandgap voltage references used in LTC switching regulators. Packaging stress causes a mean offset and room temperature distribution widening of the bandgap reference output voltage, as well as inconsistent temperature characteristics. Bandgap references with and without a proprietary stress-relief mechanism were compared to determine the impact of packaging stress on reference performance. References without stress-relief showed a mean offset of -2.3mV and spread of 10mV, while references with stress-relief showed a mean offset of -2.0mV and spread of 3.6mV. References with stress relief exhibited more consistent temperature coefficients than references without stress relief. A test chip was fabricated to allow measurement of VBE and AVBE within the bandgap reference. Parts with stress-relief showed tighter VBE and AVBE distributions, as well as more favorable temperature characteristics. The experiments in this thesis show that stress-relief is effective at improving bandgap reference performance.

kenlino

封装对Bandgap reference影响 做了比较详细的实验性分析，值得做Voltage reference的朋友参考。

changchun2000

:victory::victory::victory::victory:

dengqin

raingosi

楼主,这内容确实不错,正在找封装对BG性能的影响的资料,希望楼主还能再发点其他对BG性能产生影响是资料 呵呵!

fwutsairlin

thank you

cdting

非常感謝~~~~