Frequency-Domain Characterization of Power Distribution Networks (2007)

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Frequency-Domain Characterization of Power Distribution Networks (Artech House Microwave Library) (Hardcover)by Istvan Novak (Author), Jason R. Miller (Author)


Hardcover: 339 pages Publisher: Artech House Publishers; 1 edition (July 31, 2007) Language: English ISBN-10: 1596932007 ISBN-13: 978-1596932005

Product Description
Measure, simulate, and model power distribution networks (PDNs) accurately and efficiently with this new, cutting-edge resource. Frequency-domain analysis has revolutionized component design, and this book shows you, step-by-step, how to accurately characterize PDN components in the frequency domain including vias, bypass capacitors, planes, DC-DC converters and systems. Guiding you through the many alternatives to characterizing PDNs, it helps you to improve accuracy by choosing the right technique and avoiding the common pitfalls.
Practical examples point out the strengths and weaknesses of simulation tools as well as explain setting parameters and options. The book presents best practices for measuring that aid you in the selection of calibration processes, instruments, probes, and cables. You learn how to use frequency-domain simulations and measurements to model printed-circuit board elements, including vias, planes, bypass capacitors, inductors, and DC-DC converters. Over 300 illustrations and more than 150 equations support key topics throughout the book.

About the Author
Istvan Novak is a distinguished engineer at Sun Microsystems. A fellow of the IEEE, he holds an M.S. in electrical engineering from the Technical University of Budapest and a Ph.D. in precision electrical measurements from the Hungarian Academy of Sciences. Jason R. Miller is a senior staff engineer at Sun Microsystems. He attended Columbia University where he received his M.S. and Ph.D. in electrical engineering.

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Contents
Preface xi
Acknowledgments xv
CHAPTER 1
Introduction 1
1.1 Evolution of Power Distribution Networks 1
1.2 The Importance of Frequency Domain 2
1.3 The Impedance Matrix 4
1.3.1 Size of the Matrix 6
1.4 When Time-Domain Characterization Is Useful 8
1.5 If and When Time-Domain Response Is Needed 8
1.6 The Characterization Process 9
1.7 The Modeling Process 10
References 11
CHAPTER 2
Simulation Methods and Tools 13
2.1 Spreadsheet Calculations 13
2.2 SPICE AC 15
2.3 MATLAB 16
2.4 Field Solvers 17
2.4.1 Classifications 18
2.4.2 Convergence 22
2.4.3 Sources of Simulation Inaccuracies 25
References 41
CHAPTER 3
Characterization and Modeling of Vias 43
3.1 Introduction 43
3.2 Via Partial Inductance 43
3.3 Via Loop Inductance 47
3.3.1 Measurement Correlation 54
3.4 Via Arrays 56
3.4.1 Measuring Via Arrays 57
3.4.2 Modeling Via Arrays 60
vii
3.4.3 Parameterizing Via Arrays 61
3.4.4 Via Array Summary Points 65
References 65
CHAPTER 4
Characterization and Modeling of Planes and Laminates 67
4.1 Introduction 67
4.2 Analytical Plane Models 68
4.2.1 Analytical Models for Rectangular Plane Shapes 68
4.2.2 Analytical Plane Models for Arbitrary Plane Shapes 81
4.3 Transmission-Line Models 84
4.3.1 Transmission-Line Grid Models for Rectangular Plane Shapes 84
4.3.2 Transmission-Line Grid Models for Arbitrary Plane Shapes 86
4.3.3 Transmission Matrix Model for Arbitrary Plane Shapes 90
4.4 Effect of Plane Parameters on Self- and Transfer Impedances 92
4.4.1 Impact of Dielectric Thickness with Regular Conductors 92
4.4.2 Impact of Plane Thickness 94
4.4.3 Parallel Plane Pairs 96
4.4.4 Impact of Dielectric Constant and Dielectric Losses 96
4.4.5 Run Time Versus Number of Cells 97
4.5 Characterization of Plane and Laminate Parameters 98
4.5.1 DC Resistance of Planes 98
4.5.2 Measuring DC Resistance of Planes 100
4.5.3 Effect of Perforations on DC Plane Resistance 101
4.5.4 Simulating DC Voltage Drop and Effective Plane Resistance 102
4.5.5 Characterization of Mid- and High-Frequency Plane Parameters 102
References 120
CHAPTER 5
Impedance Measurements Basics 123
5.1 Selecting the Measurement Concept for PDN Impedance 123
5.2 The Importance of Two-Port Connections 126
5.3 Self- and Transfer Impedance 129
5.4 Transforming Measured S-Parameters 132
5.4.1 Measuring Self-Impedance with Magnitude |Zx| << 25Ω 133
5.4.2 Measuring Arbitrary Self-Impedance Values 134
5.4.3 Measuring Large Impedance Values 136
5.4.4 Measuring Arbitrary Transfer-Impedance Values 137
5.4.5 Measuring Transfer Ratios 141
5.5 Extracting Component Parameters from Measured Data 143
5.5.1 Extracting Capacitance 143
5.5.2 Extracting Equivalent Series Resistance 145
5.5.3 Extracting Inductance 146
5.5.4 Estimating Inductance and Capacitance for Compensations 152
5.5.5 Fixture Compensation, Port Extension, and De-Embedding 154
References 158
viii Contents
CHAPTER 6
Connections and Calibrations 159
6.1 Port Connections 159
6.1.1 Fixtures 159
6.1.2 Test Vias 165
6.1.3 Using Component Pads or Component Bodies as Test Points 169
6.1.4 Location of Test Points 174
6.2 Probes, Connectors, and Cables 175
6.2.1 Soldered Connections 175
6.2.2 Homemade Probes 176
6.2.3 Wafer Probes 180
6.2.4 Probe and DUT Holders and Probe Stations 180
6.2.5 Cables 181
6.3 Calibrations 183
6.3.1 VNA Calibrations in the Low-Frequency Range 183
6.3.2 VNA Calibrations in the Mid-Frequency Range 185
6.3.3 VNA Calibrations in the High-Frequency Range 186
6.4 Stability and Accuracy of Measurements 188
6.4.1 Response Drift with Time 188
6.4.2 Instrumentation Settings 189
6.4.3 Probe Placement 191
6.4.4 Quality of Probe and DUT Connections 192
References 195
CHAPTER 7
Measurements: Practical Details 197
7.1 Making the Proper Connections 197
7.1.1 Eliminating Cable-Braid-Loop Error at Low Frequencies 197
7.1.2 Examples of Correct Connections 205
7.1.3 Measuring Low Impedances at High Frequencies 218
7.2 Making the Proper Measurements 220
7.2.1 Multiple Measurements, Multiple Instruments 220
7.2.2 Averaging, Smoothing, and Bandwidth 221
7.2.3 Background Noise, Noise Floor 224
7.2.4 Repeatability of Data 224
7.3 System Measurements 225
7.3.1 Measurements of Powered Boards 227
References 228
CHAPTER 8
Characterization and Modeling of Bypass Capacitors 229
8.1 Simple C-R-L Models and Spreadsheet Correlations 229
8.2 Wideband Characterization 232
8.3 Impact of Geometry on Electrical Parameters 234
8.3.1 How to Define ESL 234
8.3.2 Impact of Body Geometry on ESL of MLCC 239
8.3.3 ESR and ESL of Very Tall Capacitors 242
Contents ix
8.3.4 Impact of Vertical MLCC Mounting on ESL and ESR 246
8.3.5 Impact of Special Geometries on ESL and ESR 248
8.3.6 Uniqueness of Parameters 252
8.4 Effect of Other Variables on Capacitor Parameters 257
8.4.1 Effect of DC and AC Bias Voltage and Piezo Effect 257
8.4.2 Effect of Environmental Variables 260
8.5 Multicomponent C-R-L Models 262
8.5.1 Multicomponent Models for Bulk Capacitors 263
8.5.2 Multicomponent Models for Ceramic Capacitors 264
8.6 Black-Box Model 267
8.6.1 The Building Blocks 268
8.6.2 Modeling of Capacitance Versus Frequency 270
8.6.3 Modeling of Inductance Versus Frequency 272
8.6.4 Modeling of Resistance (ESR) Versus Frequency 273
8.7 Bedspring Capacitor Model 274
8.8 Causal Slow-Wave Model 283
8.8.1 The Unit-Cell Model 284
8.8.2 The Lossy Transmission-Line Model 288
8.8.3 Correlations 290
References 294
CHAPTER 9
Characterization and Modeling of Inductors, DC-DC Converters,
and Systems 297
9.1 Characterization and Modeling of Inductors 298
9.1.1 Lossy Ferrite Inductors 299
9.1.2 Low-Loss Ferrite Inductors 302
9.1.3 Linear Inductor Models 302
9.1.4 Frequency-Dependent Inductor Models 306
9.2 Characterization and Modeling of Power Converters 307
9.2.1 Small-Signal Output Impedance of DC-DC Converters 308
9.2.2 Black-Box Modeling of Output Impedance 312
9.3 Modeling and Characterizing Systems 314
9.3.1 Return Path and Rail Coupling in Flip-Chip BGA Package 315
9.3.2 Core and DIMM Memory Rails with Various Populations 318
9.3.3 Detailed Characterization on High-Speed Supply Rail 321
References 326
About the Authors 327
Index 329

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