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发表于 2010-11-28 11:38:18
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1 Introduction
1.1 The objectives of this work .................................................................2
1.2 Structured analog design .....................................................................3
1.3 Transistor-level design based on the device inversion level ...............4
1.4 CAD tools for analog design assistance ..............................................5
1.5 Practical design example .....................................................................5
1.6 Book organization ...............................................................................5
2 Transistor level design
2.1 MOS transistor model .........................................................................7
2.1.1 Overview of MOS models ......................................................8
2.1.2 MOS model oriented towards transistor-level design ...........10
2.2 Transistor design parameters .............................................................10
2.2.1 Transistor symmetry and voltage definitions ........................11
2.2.2 Operating regions ..................................................................12
2.2.3 Strong inversion, pinch-off voltage and slope factor ............13
2.2.4 Weak inversion .....................................................................15
2.2.5 Drain current and specific current ........................................16
2.2.6 Saturation drain current and saturation voltage ....................18
2.2.7 Inversion factor as a measure of the device inversion
level .......................................................................................20
2.2.8 Transconductances ................................................................20
2.2.9 Normalized transconductance ...............................................22
2.2.10 Capacitances .........................................................................24
2.2.11 Intrinsic gain .........................................................................26
2.2.12 Transition frequency .............................................................27
2.2.13 Intrinsic noise ........................................................................27
2.3 Design approach ................................................................................28
2.3.1 Design parameters and design variables ...............................28
2.3.2 Table of design parameters as functions of
the design variables ...............................................................30
2.3.3 Analyses of design parameters as functions of
the design variables ...............................................................32
2.3.4 Design steps ..........................................................................40
2.3.5 Design recipes .......................................................................41
2.4 Conclusion ........................................................................................46
Bibliography ............................................................................................48
3 BSIM to EKV conversion
3.1 Motivation and purpose .....................................................................51
3.2 Conversion concept ...........................................................................52
3.3 BSIM versus EKV, the fundamental differences and
the conversion algorithm guidelines .................................................53
3.4 Conversion algorithm ........................................................................55
3.4.1 Initialization ..........................................................................57
3.4.2 Specific current calculation ..................................................59
3.4.3 Extraction of parameters VTO, GAMMA and PHI ..............60
3.4.4 Extraction of parameters LETA, WETA, and LK, Q0 .........60
3.4.5 Extraction of parameters KP, E0 ..........................................61
3.4.6 Extraction of parameters RSH, DL .......................................62
3.4.7 Extraction of parameters UCRIT, LAMBDA .......................62
3.4.8 Extraction of parameters IBA, IBB, IBN .............................64
3.4.9 Extraction of parameters TCV, BEX, and UCEX ................64
3.4.10 Extraction of parameters KF, AF ..........................................64
3.5 Conversion results .............................................................................64
3.5.1 The 0.18 μm CMOS technology conversion example ..........68
3.5.2 Results interpretation for analog design ...............................72
3.6 Conclusion .........................................................................................73
3.7 Download ..........................................................................................73
Bibliography ............................................................................................74
4 Basic analog structures
4.1 Introduction .......................................................................................77
4.2 Basic analog structures library ..........................................................77
4.2.1 Transistor in a design environment .......................................80
4.3 Structured design approach ...............................................................81
4.3.1 Circuit partitioning ................................................................82
4.3.2 Derivation of the specifications ............................................83
4.4 Transconductance structures ............................................................87
4.4.1 Common source ....................................................................87
4.4.2 Common drain ......................................................................89
4.4.3 Common gate ........................................................................92
4.4.4 Cascode and folded cascode .................................................95
4.4.5 Differential pair .....................................................................98
4.5 Load structures ................................................................................107
4.5.1 Simple current mirror ..........................................................107
4.5.2 Cascode current mirror .......................................................109
4.6 Bias structures .................................................................................110
4.6.1 Voltage bias ........................................................................110
4.6.2 Current bias .........................................................................112
4.7 Conclusion .......................................................................................114
Bibliography ..........................................................................................115
5 Procedural design scenarios
5.1 Introduction ....................................................................................117
5.1.1 Procedural design sequence for an analog amplifier ..........117
5.1.2 Definitions of the circuit-level design parameters ..............120
5.2 Procedural design scenario for a folded-cascode OTA ...................127
5.2.1 Circuit-level design parameters ..........................................127
5.2.2 Frequency analysis ..............................................................130
5.2.3 Circuit partitioning ..............................................................134
5.2.4 Derivation of the specifications ..........................................134
5.2.5 Procedural design sequence ................................................136
5.3 Procedural design scenario for a fully-differential folded
cascode OTA ...................................................................................141
5.3.1 Circuit-level design parameters ..........................................143
5.3.2 Frequency analysis ..............................................................144
5.3.3 Circuit partitioning ..............................................................147
5.3.4 Derivation of the specifications ..........................................149
5.3.5 Procedural design sequence ................................................152
5.4 Procedural design scenario for a Miller operational amplifier ........156
5.4.1 Circuit-level design parameters ..........................................157
5.4.2 Frequency analysis ..............................................................158
5.4.3 Circuit partitioning ..............................................................160
5.4.4 Derivation of the specifications ..........................................162
5.4.5 Procedural design sequence ................................................163
5.5 Conclusion .......................................................................................166
Bibliography ..........................................................................................167 |
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