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成都美资公司急需数名数字后端工程师（内推），机会难得，有意愿者请发中英文简历到mapjohnlee@sina.comPhysical Design Engineer
Job Description: 1.
Cooperate with logical engineers for product spec definition 2.
Hands on chip physical designs from netlist to GDSII, including floor planning, power planning, Place & Route, CTS, power analysis, timing closure, cross talk analysis, and physical verification 3.
Hands on IP/IO layout design 4.
Create/maintain/optimize chip physical design flow Requirements: 1.
One year or above work experience in chip APR and silicon tape-out 2.
Bachelor or above degree of Microelectronics or Electronic and Information Engineering 3.
Have thorough knowledge on CTS, STA and cross talk analysis 4.
Good knowledge on CMOS device structure, process technology, EMI/EMS, latch-up, ESD 5.
Familiar with physical design EDA tools (Cadence, Synopsys, Mentor), Unix/Linux environment 6.
Low power design and CPF/UPF experience is a plus 7.
Good scripting skill in C-shell, Perl and Tcl 8.
Good verbal and written English communication skill
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发表于 2015-1-6 09:06:00
发表于 2015-1-6 14:35:20
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