IBM上海/北京芯片设计中心招聘封装与信号完整性设计工程师（硕士）

云中的铅笔

Packaging/Noise Design Engineer Recruitment
Job Requirements:
1. Solid knowledge and industry experience in following areas:
- Package/system design experience
- Familiar with signal integrity/power integrity (SI/PI) analysis basis (modeling, simulation, tools, etc)
- Familiar with chip-package-board co-design concept and management
- Good ASIC backend design knowledge is a plus.
2. Good grasp of Perl/TCL scripts under Linux/Unix environment.
3. EE/ME/CS related background in system/chip design
4. Good communication skill in both English and Mandarin
5. Strong teamwork sense and self-motivation is required.
6. Strong technical leadership will be important consideration for senior posi
tions

Job Scopes & Responsibilities:
IBM ASIC Packaging/Noise design engineer is responsible for large scale ASIC package design&analysis, system-module SI/PI co-simulation and ASIC on

die power bus design based on IBM 65nm, 45nm, 32nm and beyond technology with IBM/industry leading EDA tools. The work scope includes one or more of

following areas:
- Supporting IBM sales team and customer on IBM early package consulting and evaluation
- Working with customer to define package netlist based on image/package co-design methodology
- Package ERC/SI/PI checking and package layout optimization
- Support customer on system-module SI/PI co-simulation
- Refine Pkg/Noise design methodology in China Design Center
- Image/Power Bus design and optimization
- Cooperate with chip physical designer on IO planning and noise awareness block optimization
- Power bus noise analysis(compression, variation, min voltage etc) using IBM tool
- Chip/package decoupling solution optimization           

Please send your Chinese and English resume in ONE word/pdf file to pengzg@cn.ibm.com

mycolee

good company and good opportunity