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检索过,没有同样的书,推荐给大家。
内容很全,也很清晰。是彩色的。
967页的大著
Fundamentals of Microsystems Packaging (EPI)
Copyright © 2004 The McGraw-Hill Companies.
Contents
1 - Introduction to Microsystems Packaging
2 - The Role of Packaging in Microelectronics
3 - The Role of Packaging in Microsystems
4 - Fundamentals of Electrical Package Design
5 - Fundamentals of Design for Reliability
6 - Fundamentals of Thermal Management
7 - Fundamentals of Single Chip Packaging
8 - Fundamentals of Multichip Packaging
9 - Fundamentals of IC Assembly
10 - Fundamentals of Wafer Level Packaging
11 - Fundamentals of Passives
12 - Fundamentals of Optoelectronics
13 - Fundamentals of RF Packaging
14 - Fundamentals of MEMS Packaging
15 - Fundamentals of Sealing and Encapsulation
16 - Fundamentals of System Level PWB Technologies
17 - Fundamentals of Board Assembly
18 - Fundamentals of Packaging Materials and Processes
19 - Fundamentals of Electrical Testing
20 - Fundamentals of Package Manufacturing
21 - Fundamentals of Microsystems Design for Environment
22 - Fundamentals of Microsystems Reliability
[ 本帖最后由 dendrite 于 2008-2-16 19:59 编辑 ] |
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