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 967页的大著
 
 Fundamentals of Microsystems Packaging (EPI)
 Copyright © 2004 The McGraw-Hill Companies.
 
 Contents
 1 - Introduction to Microsystems Packaging
 2 - The Role of Packaging in Microelectronics
 3 - The Role of Packaging in Microsystems
 4 - Fundamentals of Electrical Package Design
 5 - Fundamentals of Design for Reliability
 6 - Fundamentals of Thermal Management
 7 - Fundamentals of Single Chip Packaging
 8 - Fundamentals of Multichip Packaging
 9 - Fundamentals of IC Assembly
 10 - Fundamentals of Wafer Level Packaging
 11 - Fundamentals of Passives
 12 - Fundamentals of Optoelectronics
 13 - Fundamentals of RF Packaging
 14 - Fundamentals of MEMS Packaging
 15 - Fundamentals of Sealing and Encapsulation
 16 - Fundamentals of System Level PWB Technologies
 17 - Fundamentals of Board Assembly
 18 - Fundamentals of Packaging Materials and Processes
 19 - Fundamentals of Electrical Testing
 20 - Fundamentals of Package Manufacturing
 21 - Fundamentals of Microsystems Design for Environment
 22 - Fundamentals of Microsystems Reliability
 
 [ 本帖最后由 dendrite 于 2008-2-16 19:59 编辑 ]
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