SOP at 60GHz bands —— Three-dimensional Integration and Modeling

lotusky

Three-dimensional Integration and Modeling (Synthesis Lectures on Computational Electromagnetics)
by Emmanuil M. Tentzeris  

                               
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[size=120%]Three-dimensional Integration and Modeling
[size=120%]A Resolution in RF and Wireless Packaging
[size=120%](Synthesis Lectures on Computational Electromagnetics)
By Emmanuil M. Tentzeris



Publisher:   Not Avail
Number Of Pages:   
Publication Date:   2007-10-07
ISBN-10 / ASIN:   1598292447
ISBN-13 / EAN:   9781598292442
Binding:   Paperback


Book Description:
This book presents a compact system-on-package (SOP)-based passive front-end solution for millimeter-wave wireless communication/sensor applications, that consists of fully integrated three dimensional (3D) cavity filters/duplexers and antenna. The presented concept is applied to the design, fabrication and testing of V-band transceiver front-end modules using multilayer low temperature co-fired (LTCC) technology. In this work, various compact and high-performance passive building blocks have been developed in both microstrip and cavity configurations and their integration, enabling a complete passives integration solution for 3D low-cost wireless millimeter-wave front-end modules. It is worthy to note that most of the designs implemented comes away with novel ideas and is presented as the first extensive state-of-art components, entirely validated by measured data at 60 GHz bands.

[ 本帖最后由 lotusky 于 2008-2-9 10:27 编辑 ]

ivy8002

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fanjx

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sfei.pku

很酷啊 给出了详细的摘要还有图片 谢谢

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hero2333

最後一個  讓我載完  感溫大大大