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Editorial ReviewsProduct Description
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
From the Back Cover
AREA ARRAY PACKAGING AT THE CUTTING EDGEThe first book to bring BGA, CSP, and Flip Chip together--teaching design, application, and manufacturing how-tos. As pagers, cell phones, and other portable electronics shrink while demand for features and functions grows, the need for better, faster, smaller, cooler high-density interconnects (HDI) becomes more critical. The Area Array Packaging Handbook brings you the details you need on this rapidly expanding field in microelectronics packaging.
Filled with hands-on, leading edge information engineers need for day-to-day decision making, Area Array Packaging Handbook is an unbeatable resource for success in today's fast-paced world of HDI.
Look for these highlights inside:
*The hottest technologies in electronics packaging--BGA, CSP, and Flip Chip--all in one reference
*Details on MEMs technology
*Pros and cons of each technology in various applications
*Solutions for difficult packaging ramifications of HDI design concepts
*Detailed coverage of critical reliability and testing issues
*Help with design, materials, and manufacturing processes
*Problem-solving approaches to conception, construction, assembly, and applications
*World-class expert contributors
*400 illustrations
ADVANCES
APPLICATIONS
CONCEPTS
DESIGN
ECONOMICS
OPIMIZATION
EQUIPMENT
FUTURE TECHNOLOGY
MATERIALS
PROCESSES
PRODUCTIVITY
Product Details
[ 本帖最后由 wulala 于 2009-5-16 15:31 编辑 ] |
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