MLCC Fabrication Process

Sajid

MLCC fabrication process14 steps

1.       Slurry fabrication

Process of mixing dielectric ceramic powder with organic binder solution to produce a well dispersed slurry

2.       Ceramic sheet casting

Process of fabrication thin and uniform ceramic sheets by coating the slurry on PET film

3.       Inner electrode printing

Process of screen-printing the electrode paste onto ceramics sheets

4.       Stacking

Process of stacking the individual printed sheets according to the pre-determined design

5.       Lamination

Process of forming of stacked ceramic sheets into a monolithic bar by applying controlled, uniform pressure

6.       Cutting

Process by which the monolithic bar in separated into individual chips

7.       Binder burn out

Process of baking the chips in order to remove the carbon residue, temperature exceed 200C

8.       Firing

Process of sintering the chip at extremely high temperatures for full densification and satisfactory dielectric characteristics

9.       Tumbling

Process of slowly grinding the surface and edges of the chip for better electrode contact and to prevent chipping

10.    Termination dipping

Process of applying the external electrode by dipping each end of the chip

11.    Termination firing

Process of sintering the terminated chip at high temperature up to 800C, for electrical contact between the internal and external electrode

12.    Plating

Process of coating termination with a Nickel barrier layer, followed by a Tin layer for surface mounting

13.    Sorting

Process of measuring electrical characteristics such as capacity.

14.    Taping

Process of Packaging for shipment to consumer