Thanks for your comment! You're right that pre-layout simulations often overestimate the peak current and timing of digital circuits due to the absence of parasitic resistance and capacitance. However, in my case, the LDO is powering high-speed, analog-intensive blocks like PLLs and TDCs, which are highly sensitive to supply transients. When I include bonding wire inductance between the off-chip decoupling capacitor and the LDO output, I observe significant degradation in transient response, which could directly impact phase noise and timing resolution. So while I understand the limitations of pre-layout accuracy, I think it's still important to address these parasitics early in the design, especially for noise-sensitive applications like this.
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