Principles of Power Integrity for PDN Design--Simplified（压缩包含第10章excel）

sanboy

Principles of Power Integrity for PDN Design--Simplified: Robust and Cost Effective Design for High Speed Digital Products
by Eric Bogatin, Larry D. Smith
Released March 2017
Publisher(s): Pearson
ISBN: 9780132735568

                               
登录/注册后可看大图

Chapter 1 Engineering the Power Delivery Network
1.1   What Is the Power Delivery Network (PDN) and Why Should I Care?
1.2   Engineering the PDN
1.3   “Working” or “Robust” PDN Design
1.4   Sculpting the PDN Impedance Profile
1.5   The Bottom Line
Reference
Chapter 2 Essential Principles of Impedance for PDN Design
2.1   Why Do We Care About Impedance?
2.2   Impedance in the Frequency Domain
2.3   Calculating or Simulating Impedance
2.4   Real Circuit Components vs. Ideal Circuit Elements
2.5   The Series RLC Circuit
2.6   The Parallel RLC Circuit
2.7   The Resonant Properties of a Series and Parallel RLC Circuit
2.8   Examples of RLC Circuits and Real Capacitors
2.9   The PDN as Viewed by the Chip or by the Board
2.10 Transient Response
2.11 Advanced Topic: The Impedance Matrix
2.12 The Bottom Line
References
Chapter 3 Measuring Low Impedance
3.1   Why Do We Care About Measuring Low Impedance?
3.2   Measurements Based on the V/I Definition of Impedance
3.3   Measuring Impedance Based on the Reflection of Signals
3.4   Measuring Impedance with a VNA
3.5   Example: Measuring the Impedance of Two Leads in a DIP
3.6   Example: Measuring the Impedance of a Small Wire Loop
3.7   Limitations of VNA Impedance Measurements at Low Frequency
3.8   The Four-Point Kelvin Resistance Measurement Technique
3.9   The Two-Port Low Impedance Measurement Technique
3.10 Example: Measuring the Impedance of a 1-inch Diameter Copper Loop
3.11 Accounting for Fixture Artifacts
3.12 Example: Measured Inductance of a Via
3.13 Example: Small MLCC Capacitor on a Board
3.14 Advanced Topic: Measuring On-Die Capacitance
3.15 The Bottom Line
References
Chapter 4 Inductance and PDN Design
4.1   Why Do We Care About Inductance in PDN Design?
4.2   A Brief Review of Capacitance to Put Inductance in Perspective
4.3   What Is Inductance? Essential Principles of Magnetic Fields and Inductance
4.4   Impedance of an Inductor
4.5   The Quasi-Static Approximation for Inductance
4.6   Magnetic Field Density, B
4.7   Inductance and Energy in the Magnetic Field
4.8   Maxwell’s Equations and Loop Inductance
4.9   Internal and External Inductance and Skin Depth
4.10 Loop and Partial, Self- and Mutual Inductance
4.11 Uniform Round Conductors
4.12 Approximations for the Loop Inductance of Round Loops
4.13 Loop Inductance of Wide Conductors Close Together
4.14 Approximations for the Loop Inductance of Any Uniform Transmission Line
4.15 A Simple Rule of Thumb for Loop Inductance
4.16 Advanced Topic: Extracting Loop Inductance from the S-parameters Calculated with a 3D Field Solver
4.17 The Bottom Line
References
Chapter 5 Practical Multi-Layer Ceramic Chip Capacitor Integration
5.1   Why Use Capacitors?
5.2   Equivalent Circuit Models for Real Capacitors
5.3   Combining Multiple Identical Capacitors in Parallel
5.4   The Parallel Resonance Frequency Between Two Different Capacitors
5.5   The Peak Impedance at the PRF
5.6   Engineering the Capacitance of a Capacitor
5.7   Capacitor Temperature and Voltage Stability
5.8   How Much Capacitance Is Enough?
5.9   The ESR of Real Capacitors: First- and Second-Order Models
5.10 Estimating the ESR of Capacitors from Spec Sheets
5.11 Controlled ESR Capacitors
5.12 Mounting Inductance of a Capacitor
5.13 Using Vendor-Supplied S-parameter Capacitor Models
5.14 How to Analyze Vendor-Supplied S-Parameter Models
5.15 Advanced Topics: A Higher Bandwidth Capacitor Model
5.16 The Bottom Line
References
Chapter 6 Properties of Planes and Capacitors
6.1   The Key Role of Planes
6.2   Low-Frequency Property of Planes: Parallel Plate Capacitance
6.3   Low-Frequency Property of Planes: Fringe Field Capacitance
6.4   Low-Frequency Property of Planes: Fringe Field Capacitance in Power Puddles
6.5   Loop Inductance of Long, Narrow Cavities
6.6   Spreading Inductance in Wide Cavities
6.7   Extracting Spreading Inductance from a 3D Field Solver
6.8   Lumped-Circuit Series and Parallel Self-Resonant Frequency
6.9   Exploring the Features of the Series LC Resonance
6.10 Spreading Inductance and Source Contact Location
6.11 Spreading Inductance Between Two Contact Points
6.12 The Interactions of a Capacitor and Cavities
6.13 The Role of Spreading Inductance: When Does Capacitor Location Matter?
6.14 Saturating the Spreading Inductance
6.15 Cavity Modal Resonances and Transmission Line Properties
6.16 Input Impedance of a Transmission Line and Modal Resonances
6.17 Modal Resonances and Attenuation
6.18 Cavity Modes in Two Dimensions
6.19 Advanced Topic: Using Transfer Impedance to Probe Spreading Inductance
6.20 The Bottom Line
References
Chapter 7 Taming Signal Integrity Problems When Signals Change Return Planes
7.1   Signal Integrity and Planes
7.2   Why the Peak Impedances Matter
7.3   Reducing Cavity Noise through Lower Impedance and Higher Damping
7.4   Suppressing Cavity Resonances with Shorting Vias
7.5   Suppressing Cavity Resonances with Many DC Blocking Capacitors
7.6   Estimating the Number of DC Blocking Capacitors to Suppress Cavity Resonances
7.7   Determining How Many DC Blocking Capacitors Are Needed to Carry Return Current
7.8   Cavity Impedance with a Suboptimal Number of DC Blocking Capacitors
7.9   Spreading Inductance and Capacitor Mounting Inductance
7.10 Using Damping to Suppress Parallel Resonant Peaks Created by a Few Capacitors
7.11 Cavity Losses and Impedance Peak Reduction
7.12 Using Multiple Capacitor Values to Suppress Impedance Peak
7.13 Using Controlled ESR Capacitors to Reduce Peak Impedance Heights
7.14 Summary of the Most Important Design Principles for Managing Return Planes
7.15 Advanced Topic: Modeling Planes with Transmission Line Circuits
7.16 The Bottom Line
References
Chapter 8 The PDN Ecology
8.1   Putting the Elements Together: The PDN Ecology and the Frequency Domain
8.2   At the High-Frequency End: The On-Die Decoupling Capacitance
8.3   The Package PDN
8.4   The Bandini Mountain
8.5   Estimating the Typical Bandini Mountain Frequency
8.6   Intrinsic Damping of the Bandini Mountain
8.7   The Power Ground Planes with Multiple Via Pair Contacts
8.8   Looking from the Chip Through the Package into the PCB Cavity
8.9   Role of the Cavity: Small Boards, Large Boards, and “Power Puddles”
8.10 At the Low Frequency: The VRM and Its Bulk Capacitor
8.11 Bulk Capacitors: How Much Capacitance Is Enough?
8.12 Optimizing the Bulk Capacitor and VRM
8.13 Building the PDN Ecosystem: The VRM, Bulk Capacitor, Cavity, Package, and On-Die Capacitance
8.14 The Fundamental Limits to the Peak Impedance
8.15 Using One Value MLCC Capacitor on the Board-General Features
8.16 Optimizing the Single MLCC Capacitance Value
8.17 Using Three Different Values of MLCC Capacitors on the Board
8.18 Optimizing the Values of Three Capacitors
8.19 The Frequency Domain Target Impedance Method (FDTIM) for Selecting Capacitor Values and the Minimum Number of Capacitors
8.20 Selecting Capacitor Values with the FDTIM
8.21 When the On-Die Capacitance Is Large and Package Lead Inductance Is Small
8.22 An Alternative Decoupling Strategy Using Controlled ESR Capacitors
8.23 On-Package Decoupling (OPD) Capacitors
8.24 Advanced Section: Impact of Multiple Chips on the Board Sharing the Same Rail
8.25 The Bottom Line
References
Chapter 9 Transient Currents and PDN Voltage Noise
9.1   What’s So Important About the Transient Current?
9.2   A Flat Impedance Profile, a Transient Current, and a Target Impedance
9.3   Estimating the Transient Current to Calculate the Target Impedance with a Flat Impedance Profile
9.4   The Actual PDN Current Profile Through a Die
9.5   Clock-Edge Current When Capacitance Is Referenced to Both Vss and Vdd
9.6   Measurement Example: Embedded Controller Processor
9.7   The Real Origin of PDN Noise–How Clock-Edge Current Drives PDN Noise
9.8   Equations That Govern a PDN Impedance Peak
9.9   The Most Important Current Waveforms That Characterize the PDN
9.10 PDN Response to an Impulse of Dynamic Current
9.11 PDN Response to a Step Change in Dynamic Current
9.12 PDN Response to a Square Wave of Dynamic Current at Resonance
9.13 Target Impedance and the Transient and AC Steady-State Responses
9.14 Impact of Reactive Elements, q-Factor, and Peak Impedances on PDN Voltage Noise
9.15 Rogue Waves
9.16 A Robust Design Strategy in the Presence of Rogue Waves
9.17 Clock-Edge Current Impulses from Switched Capacitor Loads
9.18 Transient Current Waveforms Composed of a Series of Clock Impulses
9.19 Advanced Section: Applying Clock Gating, Clock Swallowing, and Power Gating to Real CMOS Situations
9.20 Advanced Section: Power Gating
9.21 The Bottom Line
References
Chapter 10 Putting It All Together: A Practical Approach to PDN Design
10.1 Reiterating Our Goal in PDN Design
10.2 Summary of the Most Important Power Integrity Principles
10.3 Introducing a Spreadsheet to Explore Design Space
10.4 Lines 1–12: PDN Input Voltage, Current, and Target Impedance Parameters
10.5 Lines 13–24: 0th Dip (Clock-Edge) Noise and On-Die Parameters
10.6 Extracting the Mounting Inductance and Resistance
10.7 Analyzing Typical Board and Package Geometries for Inductance
10.8 The Three Loops of the PDN Resonance Calculator (PRC) Spreadsheet
10.9 The Performance Figures of Merit
10.10 Significance of Damping and q-factors
10.11 Using a Switched Capacitor Load Model to Stimulate the PDN
10.12 Impulse, Step, and Resonance Response for Three-Peak PDN: Correlation to Transient Simulation
10.13 Individual q-factors in Both the Frequency and Time Domains
10.14 Rise Time and Stimulation of Impedance Peak
10.15 Improvements for a Three-Peak PDN: Reduced Loop Inductance of the Bandini Mountain and Selective MLCC Capacitor Values
10.16 Improvements for a Three-Peak PDN: A Better SMPS Model
10.17 Improvements for a Three-Peak PDN: On-Package Decoupling (OPD) Capacitors
10.18 Transient Response of the PDN: Before and After Improvement
10.19 Re-examining Transient Current Assumptions
10.20 Practical Limitations: Risk, Performance, and Cost Tradeoffs
10.21 Reverse Engineering the PDN Features from Measurements
10.22 Simulation-to-Measurement Correlation
10.23 Summary of the Simulated and Measured PDN Impedance and Voltage Features
10.24 The Bottom Line
References
Index

sutaotao2001

Thanks

jiangnaner

Thanks

student321

thanks

bingshuihuo

Thanks

killerljj

lhyi

Thanks for the share

demetrio

感谢分享

zhyu101

这个是第几个版本啊