advance semi EE290d and finfet course

peterlin2010

https://inst.eecs.berkeley.edu/~ee290d/fa13/


https://inst.eecs.berkeley.edu// ... D_LectureNotes.html

Module  I: Device Physics
  Lecture 1: course overview, history of  multiple-gate MOSFET development marked  version
  Lecture 2: MOSFET performance  metrics, short-channel MOSFET electrostatics, scale length marked version (updated on 9/11)
  Lecture 3: advantages of thin-body  MOSFETs in electrostatics, Effective drive current marked version  

Lecture 4: semiconductor band structure,  quantum confinement effect, low-field effective mobility, high-field velocity  saturation marked version

  

Lecture 5:  thin-body MOSFETs quantum confinement and carrier mobility, series  resistance, apparent mobility, ballistic transport marked version

  

Lecture 6: MOSFET compact  modeling, Technology CAD

  

Review of Module I

  

  Module  II: Device-Process Interactions
  Lecture 7: impacts of substrate, bulk  vs. SOI FinFETs,  Fin patterning, gate stack engineering marked version

  

                  Introduction  to double patterning approaches (Wikipedia)
  Lecture 8: FinFET  Source/Drain doping, thin-body MOSFET’s threshold voltage engineering marked version
  Lecture 9: Strained-Si technology I:  device physics: band structure and scattering rates vs. strain marked  version

  

Lecture 10:  Strained-Si technology II: process implementation of stressors: eSiGe, SMT, CESL, Gate-Last on Planar and FinFETs

  

Lecture 11:  process-induced performance variability I: Random marked version (updated on 11/5)

  

Lecture 12:  process-induced performance variability II: Systematic marked version

  

  Module  III: Device-Circuit Interactions
  Lecture 13: digital device’s  metrics, energy vs. delay plots,  technology advancement on logic circuits
  Lecture 14: SRAM technology &  designs, scaling trend, FinFET-based SRAM issues,  SRAM alternatives
  Lecture 15: MPU technology trends, state-of-the-art  CMOS platforms: planar MOSFETs and FinFETs

  

Lecture 16: MOSFET  analog/RF performance metrics, bulk and thin-body MOSFET’s Analog/RF  performance

  

Lecture 17: back-end-of-line  (BEOL) technology, system-level integrations: SiP,  TSV and Monolithic 3D

  Lecture 18: multiple-floating gate devices, 3-D vertical  NAND

binnq

感谢

tu_yjq123

多谢分享。。

Danielxush

Thanks

tonysu.usa

the link is not good any more

smrecnik

Thanks