台积电设计服务中心招聘IC设计工程师-base南京

saraleng

一、IC Physical design engineer（芯片物理设计工程师）

职责范围：  

1. Physical implementation of advanced technology chips.
2. Design methodology development and innovation for advanced technology challenges.
3. Be responsible for 22/16/12/10/7/5nm chip implementation for customer’s projects or internal system test chips.

4. Be responsible for advanced node PPA benchmark, and solution development.

5. EDA tool new features enablement.

6. Customer onsite/offsite supports will be required on demand.  

职位要求：   

1. MS or above in EE, CS related fields. Experience in APR, physical verification, chip implementation, or CAD development is plus.
2. 3+ years working experience in chip physical implementation.
3. Familiar with Synopsys/Cadence APR tools/flows.
4. Familiar with TCL/Perl/Python programming.
5. Experience with TSMC advanced technology is plus.
6. Proven record in production tape-outs is plus.

二、IC Frontend design engineer（芯片前端设计工程师）

职责范围：

1. RTL synthesis, SDC/UPF verification, low power design implementation for advanced technology chips.
2. Design flow/methodology development and innovation for front-end design challenges.
3. Be responsible for RTL verification, synthesis, low power design, and STA/timing closure works for customer’s projects and internal system test chips.

职位要求：

1. MS or above in EE, CS related fields. Experience in Digital IC design flow (from Synthesis, DFT, MBIST, Formality, STA), RTL design, RTL verification is plus.
2. 3+ years working experience.
3. Familiar with EE CAD tool such as Design compiler, DFT complier, MBIST, n-Lint, Verdi, Verilog tools/flows.
4. Familiar with tcl/Perl/Python program.

投递邮箱：wyleng@tsmc.com

投递主题：姓名+岗位+学历+学校