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本帖最后由 sunshanshine 于 2018-12-6 14:32 编辑
工作地点:武汉 联系邮箱:sunshineshan@126.com/xujj2013@sina.cn
Spice Modeling经理:1名 工作职责: 1.SRAM/flash and logic devicespice model development and maintenance 1)SPICE model extraction,simulation and verification 2)Model QA report summary anddocumentation 3)Model flow enhancement foradvanced technology & special process 4)Device characterization:measurement, data plot and analysis 5)SPICE model device matrix planand test key tape out 6)Model extraction related toolmaintenance 2.Customer service and support 1)Service external designer or IPvendor for model technical request 2)Support internal designservice(DS) for model/design evaluation related things 3)Support device/PIE team fordevice simulation and device tuning 3.Co-work and Communication 1)Discuss model target andextraction strategy with PIE/device 2)Co-work with DR and layout teamfor SPICE testkey tape out and optimization 3)Co-work with DRC/LVS/PEXrelated team for model related integration 4)Co-work with EDA vendor formodel extraction tool enhancement and special request build up 5)Co-work with TD/WAT team forSPICE data test related thing 4.Completed other tasks assignedby supervisor 任职资格: 1.B.S. minimum, Masters preferredin Micro-electronics of Physics, 3 or more years relevant experience 2.Familiar withMOS/Bipolar/Diode/Resistor/CAP/SRAM/flash model extraction 3.Familiar with mismatch andstatistical model 4.Familiar with hspice/spectresimulator 5.Able to design and coordinatelayouts and device matrices planning for modeling testchip development 6Hands-on experience withon-wafer DC/AC/noise characterization 7.Familiar withMBP,MQA,BSIMProPlus,MeQLab,ICCAP 8.Experience with basic softwareprogram (excel VBA/Perl/Python..) for data analysis automation will be consideredwith priori. 9.Strong communication skills andteam player, logical thinking 10.Proficiency in written andverbal English 11.Team work and problem solvingskills. Spice Modeling 工程师:两名 工作职责: 1.Familiar withMOS/Bipolar/Diode/Resistor/CAP/SRAM/flash model extraction 2.Familiar with mismatch andstatistical model 3.Familiar with hspice/spectresimulator 4.Able to design and coordinatelayouts and device matrices planning for modeling testchip development 5.Hands-on experience withon-wafer DC/AC/noise characterization 6.Familiar withMBP,MQA,BSIMProPlus,MeQLab,ICCAP 任职资格: 1. B.S Minimum, Masters preferred inMicro-electronics or Physics. 2. 3 or more year’s relevant experience. 3. Teamwork and problem solving skills. |