【2018 书】Handbook of Silicon Wafer Cleaning Technology （第三版）

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Handbook of Silicon Wafer Cleaning Technology 第三版 2018
Handbook of Silicon Wafer Cleaning Technology 第三版 2018.pdf (12.94 MB , 下载次数: 319 )

2018-10-25 13:28 上传

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第二版：
Handbook of Silicon Wafer Cleaning Technology 第二版 2008.pdf (6.22 MB , 下载次数: 91 )

2018-10-25 13:28 上传

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Cleaning of surfaces in semiconductor device processing has been of critical importance since the late 1950s and early 1960s. The reduction of stability, reliability, and device or circuit yield because of impurities incorporated during processing established that effective and efficient cleans were imperative. Until the late 1980s, clean sequences focused on the removal of native oxides, organic contamination, residual photoresist, alkali ions, and metallic species, which was accomplished primarily by wafer immersion in chemical baths. Most cleaning was performed before insertion of wafers into furnaces where diffusion of impurities into device structures (e.g., to junctions and interfaces) would be most severe.

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