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Session 15 – CMOS Scaling and Technology Implications
Cedar Ballroom, Tuesday Morning, September 18
Chair: David Sunderland
Co-Chair: Jordan Lai
This session of invited papers addresses important issues related to maintaining Moore’s Law scaling beyond 45nm, focusing on device technology, package technology, reliability and physical analysis.
8:25 am
Introduction
15.1 - 8:30 am
Reliability Trends with Advanced CMOS Scaling and the Implications for Design (INVITED PAPER)
J. McPherson, Texas Instruments
15.2 - 9:20 am
Evolution of CMOS Technology at 32 nm and Beyond (INVITED PAPER)
G. Shahidi, IBM
15.3 - 9:45 am
High-K/Metal Gate Technology: A New Horizon (INVITED PAPER)
M. Khare, IBM
10:10 am - BREAK
15.4 - 10:25 am
Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems (INVITED PAPER)
M. Bakir, B. Dang and J. Meindl, Georgia Institute of Technology
15.5 - 11:15 am
Reverse Engineering in the Semiconductor Industry (INVITED PAPER)
R. Torrance and D. James, Chipworks, Inc.
Session 16 – Signal and Data Processing
Oak Ballroom, Tuesday Afternoon, September 18
Chair: Charles Thomas
Co-Chair: Ram Krishnamurthy
This session explores new signal and data processing integrated circuits for a diverse reange of applications including medical devices, video processing and high speed communications.
2:00pm
Introduction
16.1 - 2:05 pm
Cochlear Implant Signal Processing ICs (INVITED PAPER)
B. Swanson, M. Goorevich, T. Nygard, Cochlear Ltd., E. Van Baelen, K. Van Herck, Cochlear Technology Center, and M. Janssens, NXP
16.2 - 2:55 pm
An 81.6 GOPS Object Recognition Processor Based on NoC and Visual Image Processing Memory
D. Kim, K. Kim, J.-Y. Kim, S. Lee and H.-J. Yoo, KAIST
16.3 - 3:20 pm
A Cost-effective Digital Front-End Realization For 20-bit ΣΔ DAC in 0.13µm CMOS
R. Chen, L. Liu and D. Li, Tsinghua University
3:45 pm - BREAK
16.4 - 4:00 pm
A 0.25µm 0.92mW per Mb/s Viterbi Decoder Featuring Resonant Clocking for Ultra-Low-Power 54Mb/s WLAN Communication
F. Carbognani, S. Haene, M. Arrigo, C. Pagnamenta, F. Buergin, N. Felber, H. Kaeslin and W. Fichtner, ETH Zurich
16.5 - 4:25 pm
A High-Throughput Maximum a posteriori Probability Detector
R. Ratnayake, G.-Y. Wei, Harvard University, A. Kavcic, University of Hawaii
16.6 - 4:50 pm
A 3.3-Gbps Bit-Serial Block-Interlaced Min-Sum LDPC Decoder in 0.13µm CMOS
A. Darabiha, A. Chan Carusone and F. Kschischang, University of Toronto |
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