3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility pdf

ab3028 · 发表于 2018-4-11 19:21:17

马上注册，结交更多好友，享用更多功能，让你轻松玩转社区。

您需要登录才可以下载或查看，没有账号？注册

x

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G MobilityLih-Tyng Hwang and Jason Tzyy-Sh Horng, "3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility" English | ISBN: 1119289645 | 2018 | 440 pages | PDF | 11 MB
An interdisciplinary guide to technologies and technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

Features an technologies and hardware for 3D ICs and 5G mobility
Presents , such as Microsoft's Excel and Minitab
Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
Provides chapter-wise review questions and powerpoint slides as teaching tools

3D IC and RF SiPs.pdf (11.49 MB, 下载次数: 672 )

lhyi · 发表于 2018-4-12 02:18:48

Thanks

apteye · 发表于 2018-4-12 10:29:53

thankyou.mark

dcircuit · 发表于 2018-4-12 20:20:50

kan a kan

tu_yjq123 · 发表于 2018-4-12 22:36:34

多谢分享

besarkecil · 发表于 2018-4-15 12:57:47

回复 1# ab3028

thanks for sharing

bing113 · 发表于 2018-4-22 20:15:37

了解一下楼主的资料

cikulangsat · 发表于 2018-4-23 09:42:17

回复 1# ab3028

thanks for sharing

KiddLo · 发表于 2018-4-23 10:05:05

Thanks for sharing.

ddale · 发表于 2018-4-24 17:52:03

kan a kan

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility pdf

马上注册，结交更多好友，享用更多功能，让你轻松玩转社区。

站长推荐 /2