【上海招聘】Package Engineer-TOP 美资芯片公司

sophia_miya

【上海招聘】Package Engineer-TOP 美资芯片公司，芯片封装工艺+subcon管理工作内容，有出差。

-----要求BS 8y+ 工艺技术背景，英文流利，熟悉COF（chip on flex）优先考虑。300-500K/Y， CV TO sophia_wu520@hotmail.com， thanks！！

Required Experience:

?      Minimum 8 years’ experience in semiconductor package development, layout andcharacterization. At least 2 years of Chip on Flex experience.

?      BS or greater, preferably in Physics, Mechanical Engineering, ChemicalEngineering, Material Science or a closely related field

?      Excellent communication, reasoning and problem-solving skills

?      Experience in manufacturing consumer electronics products

?      Knowledge of manufacturing process control

?      Experience with package and module development processes including writingspecifications, design, and validation

?      Solid background with hands on work ethic, team player with experience workingacross geographically diverse teams.

?      Ability to work creatively and independently with minimum supervision followingspecifications and project schedule.

?      Experience with tools used in package design and circuit, electromagnetic andthermal simulation and characterization with especially strong authority onCadence APD/APE, ACAD for custom substrate and module design

Nice to have theseadditional experiences:

?      Background in sensor packaging

?      Flip chip on laminate or flex substrate, SMT and Chip attach processes

?      Flex substrate package development

?      Materials processing including coating and molding

?      Antenna radiation and ESD characterization and improvement

sophia_miya

要求BS 8y+ 工艺技术背景，英文流利，熟悉COF（chip on flex）优先考虑。300-500K/Y， CV TO sophia_wu520@hotmail.com， thanks！！