【全职】Marvell招聘Android DSP Engineer

Hwangbo

1、Job Title: DSP System Engineer

Department: Cellular Engineering

Location: Shanghai/Nanjing

Job Description:

Physical Layer System Engineer for 3G/GSM UE

Marvell Shanghai is now looking for the TD-SCDMA, WCDMA, and GSMphysical layer engineers to join us in 3G/2G production. As a worldwide leadingfabless semiconductor company, we are working on 3G/2G communication productand technology. You would join in us in the design, development, implementationand debug of advanced physical layer firmware and system for the wirelesscommunication productions.

Qualification:

- A minimum of Bachelor degree in Electrical Engineering is requiredwith specialization in DSP or communication

- Experience in the develop of the physical layer or L1 Controller of3G/2G (TD-SCDMA, WCDMA, GSM) are preferred

- Related experience in the 3G/2G system design, Dual RAT, HSPA andsystem testing is a good plus

- Strong Digital Signal Processing knowledge in the area of digitalcommunication system and of various digital modulation schemes

- Good written and oral English skills

- Good Team work

2、Job Title: DSP/FirmwareEngineer

Department: Cellular Engineering

Location: Shanghai/Nanjing

Job Description:

-We are looking for a DSP/Firmware Engineer with solid background indigital communication and signal processing to join our system design team forwireless communication system, include 2G/3G/4G.

-The successful candidate is expected to work in a collaborative teamon cutting-edge data communication technologies. Responsibility includesdesigning algorithm and architecture and implementation for the physical layerof the modems.

-This position also requires close interaction with the digital designteam on design specification, verification and test.

Qualification:

-M.S.or Ph.D in Electrical Engineering

-About 3 yrs working experience.

-Must have strong knowledge of digital communication and signalprocessing theory

-Proficient in building up communication system simulator with C/C++and Matlab

-Knowledge and experience on the communication physical layer arepreferred

-Familiarity with DSP and RTL implementation is a good plus.

-Good communication skills in spoken and written English

-Good at collaboration and team work

3、Job Title: DSPEngineer (TD/LTE)

Department: Cellular Engineering

Location: Shanghai/Nanjing

Job Description:

-We are looking for a DSP/Firmware Engineer with solid background indigital communication and signal processing to join our system design team forwireless communication system, include 2G/3G/4G.

-The successful candidate is expected to work in a collaborative teamon cutting-edge data communication technologies. Responsibility includesdesigning algorithm and architecture and implementation for the physical layerof the modems.

-This position also requires close interaction with the digital designteam on design specification, verification and test.

Qualification:

-M.S.or Ph.D in Electrical Engineering

-About 3 yrs working experience.

-Must have strong knowledge of digital communication and signalprocessing theory

-Proficient in building up communication system simulator with C/C++and Matlab

-Knowledge and experience on the communication physical layer arepreferred

-Familiarity with DSP and RTL implementation is a good plus.

-Good communication skills in spoken and written English

-Good at collaboration and team work

4、Job Title: DSP/FirmwareAudio Engineer

Department: Cellular Engineering

Location: Shanghai/Nanjing

Job Description:

-We are looking for a Senior DSP/Firmware Engineer with solidbackground in audio processing to join our system design team for wirelesscommunication system, include 2G/3G/4G

-Help customer do audio design related to the implementation withacoustic components and hardware circuit

-Cooperate with customer to definite and develop audio DSP block

-Instruct customer to implement audio tuning

-Support customer to analyze and solve audio related problems

Qualification:

-B.Sc. in Signal & information Processing Engineering, ElectronicEngineering, Telecommunication Engineering or other relevant major

-At least 3 years of relevant working experience with emphasis onaudio DSP tuning, hardware circuit design

-Familiar with mobile phone test Standard

-Familiar with acoustic design of audio components

-Familiar with architecture application of one audio DSP processor

-Have the basic knowledge of signal process algorithm, such as echocancellation and so on

-Knowledge and experience on the communication physical layer arepreferred

-Good communication skills in spoken and written English

-Good at collaboration and team work

If you are interested in any one of the four positions, please send your resume to the following email address:   jiangrr@marvell.com

Subject of your email should be: School_Name_Applied position_Information source
Eg.SJTU_Zhang Peng _Data Analyst_BBS