NXP香港的Package Development 职位来啦

NXP_HR

Candidate Responsibilities:
-Develop and qualify new Semiconductor package, process and materials.
-Lead cross-site high complexity projects ensure successful completion to targets within budget and schedule.
-Identify cost down opportunity and drive projects to enhance package competitiveness
-Provide guidance to project team on application of statistical analysis tools, failure analysis, simulation and problem solving techniques in package design and development.


Candidate Profile:
-Minimum 10 years working experience in semiconductor assembly.
-PhD or Master degree in engineering disciplines or materials science.
-Experience in package development process validation and qualification, in-house or subcon.
-Experience in Wafer level and QFN packaging, define and manage Design Rule and Platform roadmap.
-Project management in multi-site participation environment, PMP qualified preferred.
-Sound knowledge in statistical analysis, quality and problem solving tools, e.g. DOE, SPC, FMEA, Ford 8D, etc.
-Qualification in 6 sigma black belt is an advantage.
-Strong customer focus, proactive and able to work within minimum supervision
-Creative in new ideas and solutions
-Good interpersonal and liaison skills in cross-functional team
-Good command of written and spoken English. Putonghua is an advantage


想去香港工作的亲们快投递你的简历到recruiter team 的邮箱 elsa.junshan.qi@nxp.com