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Power-Rail ESD Clamp Circuits
with Gate Leakage Consideration in
Nanoscale CMOS Technology
Abstract CMOS technology has been widely used to produce
many integrated circuits (ICs). However, the thinner gate oxide in
nanoscale CMOS technology seriously increases the difficulty of
electrostatic discharge (ESD) protection design. The power-rail
ESD clamp circuit has been the key circuit to perform the
whole-chip ESD protection scheme. Some ESD detection circuits
were developed to trigger on ESD devices across the power rails to
quickly discharge ESD current away from the internal circuits.
Therefore, on-chip ESD protection circuits must be designed with
the consideration of standby leakage to minimize the power
consumption and the possibility of malfunction to normal circuit
operation. The design of power-rail ESD clamp circuits with low
standby leakage current and high efficiency of layout area in
nanoscale CMOS technology is reviewed in this paper. The
comparisons among those power-rail ESD clamp circuits are also
discussed.
Index Terms Electrostatic discharge (ESD), gate leakage, layout
area, power-rail ESD clamp circuit. |
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