NO.265-IC封装设计工程师(Fuzhou)

kthr

工作职责
承担部分产品的封装基板设计，导入量产；
配合公司其他设计团队，评估分析封装可行性，提供有竞争力的封装方案；

职位要求
1、大学本科或硕士毕业，3年以上BGA WireBond设计相关经验；
2、熟悉芯片封装工艺和相关流程，跟封装Vendor能很好的交流
3、熟悉FlipChip BGA、PoP、SiP等先进的封装技术
4、具有良好的沟通能力、分析问题能力、较强的协调能力，以及团队合作意识
5、了解封装信号完整性仿真，热模拟者优先

KT Human Resources Consulting Company (Shanghai) was established in 2001 in response to a need for a recruitment consultancy to be an active, contributing member of the semiconductor community, as opposed to simply a supplier to it.We provide professional search and talent acquisition in the Integrated Circuit、Electronic、Telecommunications industry of international corporations in Greater China. Our client list contains numerous international companies, many of them are long-term customers.
If you interested in the job, pls sent your cv to: hr@kthr.com, thanks!

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