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[资料] [ebook]EDA for IC Implementation Circuit Design and Process Technology

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发表于 2012-8-14 14:57:43 | 显示全部楼层 |阅读模式

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EDA for IC Implementation Circuit Design and Process Technology高清版。
 楼主| 发表于 2012-8-14 14:58:54 | 显示全部楼层
再加上附件。

EDA for IC Implementation Circuit Design and Process Technology.pdf

9.58 MB, 下载次数: 1248 , 下载积分: 资产 -4 信元, 下载支出 4 信元

发表于 2012-8-15 09:27:07 | 显示全部楼层
本帖最后由 wind2000sp3 于 2012-8-15 09:44 编辑

还不错,目录是这样的:SECTION I RTL to GDS-II, or Synthesis, Place, and Route
1 Design Flows
Leon Stok, David Hathaway, Kurt Keutzer, and David Chinnery    1-1
1.1 Introduction    1-1
1.2 Invention     1-2
1.3 Implementation     1-2
1.4 Integration     1-5
1.5 Future Scaling Challenges     1-10
1.6 Conclusion     1-12
2 Logic Synthesis
Sunil P. Khatri and Narendra V. Shenoy     2-1
2.1 Introduction    2-1
2.2 Behavioral and Register Transfer-Level Synthesis     2-2
2.3 Two-Level Minimization    2-3
2.4 Multilevel Logic Minimization     2-4
2.5 Enabling Technologies for Logic Synthesis    2-10
2.6 Sequential Optimization    2-11
2.7 Physical Synthesis     2-13
2.8 Multivalued Logic Synthesis     2-14
2.9 Summary     2-15
3 Power Analysis and Optimization from Circuit to Register-Transfer Levels
Jose Monteiro, Rakesh Patel, and Vivek Tiwari      3-1
3.1 Introduction      3-1
3.2 Power Analysis      3-2
3.3 Circuit-Level Power Optimization     3-8
3.4 Logic Synthesis for Low Power     3-12
3.5 Conclusion     3-15


4 Equivalence Checking
Andreas Kuehlmann and Fabio Somenzi     4-1
4.1 Introduction     4-1
4.2 Equivalence Checking Problem    4-3
4.3 Boolean Reasoning     4-5
4.4 Combinational Equivalence Checking      4-10
4.5 Sequential Equivalence Checking     4-14
4.6 Summary      4-17
5 Digital Layout — Placement
Andrew B. Kahng and Sherief Reda  5-1
5.1 Introduction: Placement Problem and Contexts  5-1
5.2 Global Placement 5-4
5.3 Detailed Placement and Legalizers  5-15
5.4 Placement Trends  5-17
5.5 Academic and Industrial Placers   5-19
5.6 Conclusions   5-20
6 Static Timing Analysis
Sachin S. Sapatnekar   6-1
6.1 Introduction   6-1
6.2 Representation of Combinational and Sequential Circuits   6-1
6.3 Gate Delay Models    6-3
6.4 Timing Analysis for Combinational Circuits   6-3
6.5 Timing Analysis for Sequential Circuits   6-7
6.6 Clocking Disciplines: Edge-Triggered Circuits   6-8
6.7 Clocking and Clock-Skew Optimization   6-9
6.8 Statistical Static Timing Analysis   6-12
6.9 Conclusion   6-15
7 Structured Digital Design
Fan Mo and Robert K. Brayton   7-1
7.1 Introduction   7-1
7.2 Datapaths   7-2
7.3 Programmable Logic Arrays    7-13
7.4 Memory and Register Files   7-15
7.5 Structured Chip Design   7-17
7.6 Summary   7-21
8 Routing
Louis Scheffer   8-1
8.1 Introduction   8-2
8.2 Types of Routers   8-2
8.3 A Brief History of Routing   8-4
8.4 Common Routing Algorithms   8-5
8.5 Additional Router Considerations  8-9
9 Exploring Challenges of Libraries for Electronic Design
James Hogan and Scott T. Becker   9-1
9.1 Introduction   9-1
9.2 What Does It Mean to Design Libraries?   9-1


9.3 How Did We Get Here, Anyway?   9-2
9.4 Commercial Efforts   9-5
9.5 What Makes the Effort Easier?   9-5
9.6 The Enemies of Progress   9-6
9.7 Environments That Drive Progress . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-6
9.8 Libraries and What They Contain   9-6
9.9 Summary   9-7
10 Design Closure
Peter J. Osler and John M. Cohn  10-1
10.1 Introduction   10-1
10.2 Current Practice   10-13
10.3 The Future of Design Closure   10-28
10.4 Conclusion    10-30
11 Tools for Chip-Package Codesign
Paul D. Franzon    11-1
11.1 Introduction    11-1
11.2 Drivers for Chip-Package Codesign   11-1
11.3 Digital System Codesign Issues   11-2
11.4 Mixed-Signal Codesign Issues   11-5
11.5 I/O Buffer Interface Standard and Other Macromodels    11-5
11.6 Conclusions    11-7
12 Design Databases
Mark Bales    12-1
12.1 Introduction     12-1
12.2 History     12-2
12.3 Modern Database Examples   12-3
12.4 Fundamental Features    12-4
12.5 Advanced Features     12-9
12.6 Technology Data     12-12
12.7 Library Data and Structures: Design-Data Management    12-13
12.8 Interoperability Models     12-13
13 FPGA Synthesis and Physical Design
Mike Hutton and Vaughn Betz     13-1
13.1 Introduction     13-1
13.2 System-Level Tools     13-6
13.3 Logic Synthesis     13-6
13.4 Physical Design     13-13
13.5 Looking Forward    13-26
SECTION II Analog and Mixed-Signal Design
14 Simulation of Analog and RF Circuits and Systems
Jaijeet Roychowdhury and Alan Mantooth     14-1
14.1 Introduction     14-1
14.2 Differential-Algebraic Equations for Circuits via Modified Nodal Analysis     14-2


14.3 Device Models     14-4
14.4 Basic Circuit Simulation: DC Analysis    14-10
14.5 Steady-State Analysis    14-13
14.6 Multitime Analysis    14-17
14.7 Noise in RF Design     14-25
14.8 Conclusions    14-35
15 Simulation and Modeling for Analog and Mixed-Signal Integrated Circuits
Georges G.E. Gielen and Joel R. Phillips    15-1
15.1 Introduction     15-2
15.2 Top-Down Mixed-Signal Design Methodology    15-2
15.3 Mixed-Signal and Behavioral Simulation    15-8
15.4 Analog Behavioral and Power Model Generation Techniques    15-14
15.5 Symbolic Analysis of Analog Circuits     15-18
15.6 Conclusions     15-20
16 Layout Tools for Analog Integrated Circuits and Mixed-Signal
Systems-on-Chip: A Survey
Rob A. Rutenbar and John M. Cohn     16-1
16.1 Introduction     16-1
16.2 Analog Layout Problems and Approaches     16-2
16.3 Analog Cell Layout Strategies     16-5
16.4 Mixed-Signal System Layout    16-8
16.5 Field-Programmable Analog Arrays    16-11
16.6 Conclusions    16-11
SECTION III Physical Verification
17 Design Rule Checking
Robert Todd, Laurence Grodd, and Katherine Fetty    17-1
17.1 Introduction     17-1
17.2 Geometric Algorithms for Physical Verification     17-6
17.3 Hierarchical Data Structures   17-7
17.4 Time Complexity of Hierarchical Analysis     17-8
17.5 Connectivity Models    17-9
17.6 Parallel Computing     17-11
17.7 Future Roles for Verification    17-11
18 Resolution Enhancement Techniques and Mask Data Preparation
Franklin M. Schellenberg     18-1
18.1 Introduction     18-1
18.2 Lithographic Effects     18-2
18.3 RET for Smaller k1     18-5
18.4 Software Implementations of RET Solutions    18-11
18.5 Mask Data Preparation    18-24
18.6 Summary    18-27
19 Design for Manufacturability in the Nanometer Era
Nicola Dragone, Carlo Guardiani, and Andrzej J. Strojwas    19-1
19.1 Introduction     19-1
19.2 Taxonomy of Yield Loss Mechanisms    19-3


19.3 Logic Design for Manufacturing    19-6
19.4 Parametric Design for Manufacturing Methodologies     19-13
19.5 Design for Manufacturing Integration in the Design Flow: Yield–Aware
Physical Synthesis     19-18
19.6 Summary      19-20
20 Design and Analysis of Power Supply Networks
David Blaauw, Sanjay Pant, Rajat Chaudhry, and Rajendran Panda     20-1
20.1 Introduction     20-1
20.2 Voltage-Drop Analysis Modes     20-3
20.3 Linear System Solution Techniques     20-5
20.4 Models for Power Distribution Networks     20-8
20.5 Conclusions    20-13
21 Noise Considerations in Digital ICs
Vinod Kariat     21-1
21.1 Introduction     21-1
21.2 Why Has Noise Become a Problem for Digital Chips?     21-2
21.3 Noise Effects in Digital Designs     21-3
21.4 Static Noise Analysis     21-7
21.5 Electrical Analysis     21-14
21.6 Fixing Noise Problems     21-18
21.7 Summary and Conclusions   21-20
22 Layout Extraction
William Kao, Chi-Yuan Lo, Mark Basel, Raminderpal Singh,
Peter Spink, and Louis Scheffer    22-1
22.1 Introduction    22-1
22.2 Early History     22-2
22.3 Problem Analysis     22-2
22.4 System Capabilities     22-3
22.5 Converting Drawn Geometries to Actual Geometries     22-4
22.6 Designed Device Extraction      22-5
22.7 Connectivity Extraction     22-7
22.8 Parasitic Resistance Extraction     22-8
22.9 Capacitance Extraction Techniques    22-10
22.10 Inductance Extraction Techniques     22-13
22.11 Network Reduction    22-17
22.12 Process Variation    22-18
22.13 Conclusions and Future Study     22-19
23 Mixed-Signal Noise Coupling in System-on-Chip Design:
Modeling, Analysis, and Validation
Nishath Verghese and Makoto Nagata     23-1
23.1 Introduction     23-2
23.2 Mechanisms and Effects of Mixed-Signal Noise Coupling     23-2
23.3 Modeling of Mixed-Signal Noise Coupling      23-7
23.4 Mixed-Signal Noise Measurement and Validation    23-18
23.5 Application to Placement and Power Distribution Synthesis    23-19
23.6 Summary     23-21


SECTION IV Technology CAD
24 Process Simulation
Mark D. Johnson     24-1
24.1 Introduction     24-1
24.2 Process Simulation Methods     24-2
24.3 Ion Implantation    24-3
24.4 Diffusion     24-8
24.5 Oxidation    24-12
24.6 Etch and Deposition     24-13
24.7 Lithography and Photoresist Modeling     24-20
24.8 Silicidation     24-20
24.9 Mechanics Modeling     24-20
24.10 Putting It All Together    24-22
24.11 Conclusions    24-23
25 Device Modeling —From Physics to Electrical Parameter Extraction
Robert W. Dutton, Chang-Hoon Choi, and Edwin C. Kan    25-1
25.1 Introduction     25-1
25.2 MOS Technology and Intrinsic Device Modeling    25-3
25.3 Parasitic Junction and Inhomogeneous Substrate Effects     25-20
25.4 Device Technology Alternatives     25-23
25.5 Conclusions    25-26
26 High-Accuracy Parasitic Extraction
Mattan Kamon and Ralph Iverson     26-1
26.1 Introduction     26-2
Part I: Extraction via Fast Integral Equation Methods    26-3
26.2 Introduction     26-3
26.3 Forms of Maxwell’s Equations    26-3
26.4 Fast Field Solvers: Capacitance Solution  
26.5 Fast Inductance Solution     26-7
26.6 Distributed RLC and Full Wave     26-11
26.7 Conclusions     26-14
Part II: Statistical Capacitance Extraction   26-14
26.8 Introduction     26-14
26.9 Theory      26-15
26.10 Characteristics    26-17
26.11 Summary    26-22
Index       Index-1
发表于 2012-8-15 10:41:56 | 显示全部楼层
好资料!!!!!!!!!!!!
发表于 2012-8-15 11:09:56 | 显示全部楼层
挺不错哦的,谢谢lz分享!
发表于 2012-8-24 11:22:54 | 显示全部楼层
gooooooooooooooood
发表于 2012-8-24 13:04:04 | 显示全部楼层
thanks!!!!!!!!!!!!!!!!!!!!!1
发表于 2012-9-25 17:29:43 | 显示全部楼层
goodgoodgood
发表于 2012-10-13 05:10:18 | 显示全部楼层
很好的一本书,我们的沙深哥都让看的
发表于 2012-11-4 05:09:55 | 显示全部楼层
回复 1# xuleiwx
Thanks!!!
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