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我是新手,在网上下载到ncsu的免费cdk,请问一下,去哪里找他们的design rule和其他的一些参数呢,比如像mose管的最大电流密度,Vth,Cox,单位面积的电阻率,等等。。
我上mosis找了,英文不太好,没有找到。
另外
1.NCSU_TechLib_ami06
2.NCSU_TechLib_hp06
上面这两个分别是什么公司的呢?MOSIS上好像没有提到这个两个的。有提到这些但是不知道对应是那一家。
麻烦高手指点一下,告诉我design rule 和其他一些参数怎么找。谢谢了
[size=-1][size=-1]IBM Fabrication Processes
The IBM fabrication processes available through MOSIS range from 45 nanometer to 0.25 µm in CMOS, and from 0.13 µm to 0.50 µm in SiGe BiCMOS.
[size=-1]TSMC Fabrication Processes
The TSMC fabrication processes available through MOSIS range from 40 nanometer to 0.35 µm. Low power, low voltage, and high voltage options are available in most of these technologies.
[size=-1]ON Semiconductor Fabrication Processes
The ON Semi CMOS processes available through MOSIS range from 0.35 µm to 0.7 µm.
[size=-1]austriamicrosystems Fabrication Processes
Processes offered by MOSIS through austriamicrosystems include 0.35 µm CMOS, high voltage CMOS, SiGe BiCMOS, and 0.18 µm CMOS and high voltage CMOS.
[size=-1]Globalfoundries Fabrication Processes
Processes offered by MOSIS through Globalfoundries include 65 nanometer.
[size=-1]Tezzaron Fabrication Processes
The Tezzaron fabrication processes available through MOSIS include two-tier 3DIC 130 nm CMOS.
[size=-1]Peregrine Fabrication Processes
The Peregrine fabrication processes available through MOSIS include both 0.50 µm SOS process (FC and FA), and the two versions of the 0.25 µm SOS process (GA and GC).
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