3G PA datasheet

bonarf · 发表于 2011-3-15 10:10:51

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PRODUCT DESCRIPTION
BN7301 is a monolithically integrated power amplifier Module. The PA is manufactured on Heterojunction Bipolar Transistor(HBT) process and has been designed for WCDMA/TD-SCDMA handheld equipment and other wireless applications in the 1880MHz ~ 2025MHz band. The package of this chip is 4mm×4 mm×1.1mm LGA with 10 pins. The input and output are internally matched to 50Ω to simplify the system design.

FEATURES
1.Advanced HBT process
2.27dBm linear output power
3.Low quiescent current
4.Good linearity
5.High efficiency
6.3.0~5.0 V Power supply voltage

BN7301datasheetv0.1(1).pdf (91.96 KB, 下载次数: 17 )

uqmeuqmeuqme · 发表于 2011-4-7 16:16:24

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bambucha2007 · 发表于 2011-5-8 15:41:14

good communityhere !

nbucq6 · 发表于 2011-8-6 22:14:24

Thanks.

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[资料] 3G PA datasheet

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