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Section 1 Quality Assurance ..........1
1.1 Renesas' Approach to Quality Assurance ...... 1
1.2 Quality Assurance System for Semiconductor Devices ......... 1
1.3 Quality Assurance at Development Stage ...... 4
1.4 Quality Assurance at Mass Production Stage 6
1.5 Change Control .......... 9
1.6 Product Identification and Traceability ........ 10
1.7 Failure After Shipping and Corrective Actions ........ 12
1.8 Quality Assurance for Materials And Parts .. 13
1.9 Environmentally-Friendly Design .... 15
1.9.1 Expansion of Green Procurement ... 16
1.9.2 Reduction of Environmental Impact in the New Product Development Stage
(Product Environment Assessment) 16
1.9.3 Management of Chemical Substances ........ 17
Section 2 Reliability .........19
2.1 Failure rate function . 19
2.2 Dependencies of failure rate function .......... 20
2.2.1 Initial Failures ......... 22
2.2.2 Random Failures ..... 22
2.2.3 Wear-out Failures ... 23
2.3 Screening ..... 23
2.4 Forecasting Lifetime 25
2.5 Properties of Semiconductor Reliability ...... 26
2.6 Reliability Criteria ... 28
2.6.1 Initial Failure Period Criteria .......... 28
2.6.2 Random Failure Period Criteria ...... 29
Section 3 Reliability Testing and Reliability Prediction .35
3.1 What Is Reliability Testing .. 35
3.2 Reliability Test Methods ...... 37
3.3 Accelerated Lifetime Test Methods . 44
3.3.1 Fundamental Failure Model 44
3.3.2 Method of Accelerated Life Testing ........... 49
3.3.3 Analysis of Test Results ...... 52
3.3.4 Procedure for Failure Rate Prediction With 60% Confidence Level .......... 63
Section 1 Quality Assurance ..........1
1.1 Renesas' Approach to Quality Assurance ...... 1
1.2 Quality Assurance System for Semiconductor Devices ......... 1
1.3 Quality Assurance at Development Stage ...... 4
1.4 Quality Assurance at Mass Production Stage 6
1.5 Change Control .......... 9
1.6 Product Identification and Traceability ........ 10
1.7 Failure After Shipping and Corrective Actions ........ 12
1.8 Quality Assurance for Materials And Parts .. 13
1.9 Environmentally-Friendly Design .... 15
1.9.1 Expansion of Green Procurement ... 16
1.9.2 Reduction of Environmental Impact in the New Product Development Stage
(Product Environment Assessment) 16
1.9.3 Management of Chemical Substances ........ 17
Section 2 Reliability .........19
2.1 Failure rate function . 19
2.2 Dependencies of failure rate function .......... 20
2.2.1 Initial Failures ......... 22
2.2.2 Random Failures ..... 22
2.2.3 Wear-out Failures ... 23
2.3 Screening ..... 23
2.4 Forecasting Lifetime 25
2.5 Properties of Semiconductor Reliability ...... 26
2.6 Reliability Criteria ... 28
2.6.1 Initial Failure Period Criteria .......... 28
2.6.2 Random Failure Period Criteria ...... 29
Section 3 Reliability Testing and Reliability Prediction .35
3.1 What Is Reliability Testing .. 35
3.2 Reliability Test Methods ...... 37
3.3 Accelerated Lifetime Test Methods . 44
3.3.1 Fundamental Failure Model 44
3.3.2 Method of Accelerated Life Testing ........... 49
3.3.3 Analysis of Test Results ...... 52
3.3.4 Procedure for Failure Rate Prediction With 60% Confidence Level .......... 63
3.4 Reliability Prediction Based on the Failure Mechanism ...... 64
3.4.1 Example of Predicting the Initial Failure Rate
(Initial Failures from Oxide Film Breakdown) ....... 65
3.4.2 Example of Predicting the Random Failure Rate
(Method of Estimating a Failure Rate at a 60% Reliability Level) . 67
3.4.3 Predicting Wear-Out Failures ......... 80
3.4.4 Future Product Life . 80
Section 4 Failure Mechanisms .....83
4.1 Failure Classification ........... 83
4.2 Failure Mechanisms related to the Wafer Process ... 89
4.2.1 Time Dependent Dielectric Breakdown ...... 90
4.2.2 Hot Carrier .. 93
4.2.3 NBTI (Negative Bias Temperature Instability) ....... 97
4.2.4 Electromigration ..... 99
4.2.5 Stress Migration .... 101
4.2.6 Soft Error .. 102
4.2.7 Reliability of Non-Volatile Memory ........ 106
4.3 Failure Mechanisms related to the Assembly Process ....... 110
4.3.1 Wire Bonding Reliability (Au-Al Joint Reliability) .......... 110
4.3.2 Ag Ion Migration .. 114
4.3.3 Cu Ion Migration .. 117
4.3.4 Al Sliding .. 119
4.3.5 Mechanism of Filler-Induced Failure ....... 121
4.3.6 Whiskers ... 123
4.3.7 Moisture Resistance of Resin Mold Semiconductor Devices ....... 124
4.4 Failure Mechanisms related to the Mounting Process and During Practical Use .. 131
4.4.1 Cracks of the Surface-Mounted Packages in Reflow or Flow Soldering .. 131
4.5 Mechanism of Failures Related to Handling .......... 145
4.5.1 Electrostatic Discharge ..... 145
4.5.2 Latchup ..... 161
4.5.3 Power MOS FET Damage 164
Section 5 Failure Analysis .........173
5.1 Why Failure Analysis Is Necessary? .......... 173
5.2 What Is Failure Analysis? .. 173
5.3 Procedure of Failure Analysis ........ 174
5.3.1 Investigation of Failure Circumstances ..... 174
5.3.2 Preservation of Failed Devices ..... 175
5.3.3 Visual Inspection .. 176
5.3.4 Evaluation for Electrical Characteristics ... 178
5.3.5 Internal Analysis of a Package ...... 181
5.3.6 Locating Failure Points In A Chip 183
5.3.7 Physical Analysis .. 201
5.3.8 Establishment of Failure Mechanism ........ 209
5.3.9 Appendix (List of Analysis Techniques) .. 210
Section 6 Usage Precautions ......221
6.1 Device Selection .... 221
6.1.1 Maximum Ratings . 221
6.1.2 Derating .... 222
6.1.3 Using a Device with Equivalent Function 230
6.1.4 When a Device is Used in a Severe Environment . 233
6.1.5 When Using a Device in an Application that Requires High Reliability .. 233
6.2 Preventing Electrostatic Discharge (ESD) Damage ........... 235
6.2.1 ESD Damage ......... 235
6.2.2 Latchup ..... 251
6.3 Preventing Mechanical Damage .... 255
6.3.1 Lead Forming and Cutting 255
6.3.2 Mounting on a Printed Circuit Board ........ 260
6.3.3 Flux Cleaning Methods ..... 264
6.3.4 Attachment of the Heat-Sink Plate 267
6.4 Preventing Thermal Damage ......... 277
6.4.1 Soldering Temperature Profile ...... 277
6.4.2 Precautions in Handling a Surface-Mount Device 280
6.4.3 Using Reflow to Attach Surface-Mount Devices .. 282
6.4.4 Recommended Conditions for Various Methods of
Mounting Surface-Mount Devices 282
6.5 Preventing Malfunction ...... 286
6.5.1 Precautions with Respect to Hardware ..... 286
6.5.2 Precautions in Circuit Design ....... 286
6.5.3 Precautions for Board Mounting ... 289
6.5.4 Precautions against Malfunction due to Noise ...... 293
6.5.5 Precautions on Signal Waveforms 296
6.5.6 Precautions with Regard to the Environmental Conditions in
which the Device is Used .. 300
6.6 Software Precautions ......... 302
6.7 Being Prepared for Possible Malfunction .. 303
6.8 Failure-Detection Ratio during Test ........... 305
6.9 Precautions in Packaging ... 310
5.3.4 Evaluation for Electrical Characteristics ... 178
5.3.5 Internal Analysis of a Package ...... 181
5.3.6 Locating Failure Points In A Chip 183
5.3.7 Physical Analysis .. 201
5.3.8 Establishment of Failure Mechanism ........ 209
5.3.9 Appendix (List of Analysis Techniques) .. 210
Section 6 Usage Precautions ......221
6.1 Device Selection .... 221
6.1.1 Maximum Ratings . 221
6.1.2 Derating .... 222
6.1.3 Using a Device with Equivalent Function 230
6.1.4 When a Device is Used in a Severe Environment . 233
6.1.5 When Using a Device in an Application that Requires High Reliability .. 233
6.2 Preventing Electrostatic Discharge (ESD) Damage ........... 235
6.2.1 ESD Damage ......... 235
6.2.2 Latchup ..... 251
6.3 Preventing Mechanical Damage .... 255
6.3.1 Lead Forming and Cutting 255
6.3.2 Mounting on a Printed Circuit Board ........ 260
6.3.3 Flux Cleaning Methods ..... 264
6.3.4 Attachment of the Heat-Sink Plate 267
6.4 Preventing Thermal Damage ......... 277
6.4.1 Soldering Temperature Profile ...... 277
6.4.2 Precautions in Handling a Surface-Mount Device 280
6.4.3 Using Reflow to Attach Surface-Mount Devices .. 282
6.4.4 Recommended Conditions for Various Methods of
Mounting Surface-Mount Devices 282
6.5 Preventing Malfunction ...... 286
6.5.1 Precautions with Respect to Hardware ..... 286
6.5.2 Precautions in Circuit Design ....... 286
6.5.3 Precautions for Board Mounting ... 289
6.5.4 Precautions against Malfunction due to Noise ...... 293
6.5.5 Precautions on Signal Waveforms 296
6.5.6 Precautions with Regard to the Environmental Conditions in
which the Device is Used .. 300
6.6 Software Precautions ......... 302
6.7 Being Prepared for Possible Malfunction .. 303
6.8 Failure-Detection Ratio during Test ........... 305
6.9 Precautions in Packaging ... 310
6.10 Storage Precautions 313
6.11 Precautions in Transport .... 317
6.12 Product Safety ........ 318
6.13 Examples of Other Categories of Problems ........... 320
Section 7 Standards and Certification Schemes for the Quality System,
Safety, and Reliability of Semiconductor Devices ....325
7.1 Quality System Standards .. 325
7.1.1 Overview of the ISO 9000 Series . 325
7.1.2 ISO 9000 Family Standards (Standards of the Year 2000) ........... 325
7.1.3 Registration Systems for the ISO 9000 Series ...... 326
7.2 Safety-Related Standards ... 327
7.2.1 Introduction ........... 327
7.2.2 CE Marking System .......... 328
7.3 Reliability-Related Standards ........ 329
7.3.1 Introduction ........... 329
7.3.2 JIS Standards ........ 329
7.3.3 JEITA (EIAJ) Standards ... 329
7.3.4 JEDEC Standards .. 330
7.3.5 IEC Standards ....... 330
7.3.6 CECC Standards ... 331
7.3.7 MIL Standards ...... 331
7.4 Certification Systems ......... 332
7.4.1 Mutual Relationships of Certification Systems in the World ....... 332
7.4.2 Reliability Certification Systems for Semiconductor Devices ...... 333
Appendix .........345
A. Attached Tables ..... 345
A.1 AQL Sampling Table (SOURCE: JIS Z 9015) ..... 345
A.2 LTPD Sampling Table (Source: MIL-S-19500, sampling inspection tables) ....... 349
A.3 Probability Density of Normal Distribution .......... 351
A.4 Upper Probability of Normal Distribution 353
A.5 Percent Points of Normal Distribution ...... 356
A.6 Poisson Distribution (Probability) 359
A.7 Vibration Tables (Amplitude, Velocity, and Acceleration vs. Frequency)........... 370
A.8 Water Vapor Pressure Tables ........ 371
B. Reliability Theory .. 373
B.1 Reliability Criteria 373
B.2 Reliability of Composite Devices . 378
B.3 Failure Models for Accelerated Life Testing ........ 382
6.10 Storage Precautions 313
6.11 Precautions in Transport .... 317
6.12 Product Safety ........ 318
6.13 Examples of Other Categories of Problems ........... 320
Section 7 Standards and Certification Schemes for the Quality System,
Safety, and Reliability of Semiconductor Devices ....325
7.1 Quality System Standards .. 325
7.1.1 Overview of the ISO 9000 Series . 325
7.1.2 ISO 9000 Family Standards (Standards of the Year 2000) ........... 325
7.1.3 Registration Systems for the ISO 9000 Series ...... 326
7.2 Safety-Related Standards ... 327
7.2.1 Introduction ........... 327
7.2.2 CE Marking System .......... 328
7.3 Reliability-Related Standards ........ 329
7.3.1 Introduction ........... 329
7.3.2 JIS Standards ........ 329
7.3.3 JEITA (EIAJ) Standards ... 329
7.3.4 JEDEC Standards .. 330
7.3.5 IEC Standards ....... 330
7.3.6 CECC Standards ... 331
7.3.7 MIL Standards ...... 331
7.4 Certification Systems ......... 332
7.4.1 Mutual Relationships of Certification Systems in the World ....... 332
7.4.2 Reliability Certification Systems for Semiconductor Devices ...... 333
Appendix .........345
A. Attached Tables ..... 345
A.1 AQL Sampling Table (SOURCE: JIS Z 9015) ..... 345
A.2 LTPD Sampling Table (Source: MIL-S-19500, sampling inspection tables) ....... 349
A.3 Probability Density of Normal Distribution .......... 351
A.4 Upper Probability of Normal Distribution 353
A.5 Percent Points of Normal Distribution ...... 356
A.6 Poisson Distribution (Probability) 359
A.7 Vibration Tables (Amplitude, Velocity, and Acceleration vs. Frequency)........... 370
A.8 Water Vapor Pressure Tables ........ 371
B. Reliability Theory .. 373
B.1 Reliability Criteria 373
B.2 Reliability of Composite Devices . 378
B.3 Failure Models for Accelerated Life Testing ........ 382 |
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发表于 2010-7-17 22:09:40
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