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 The seminal reason for this book is the lack of a unified treatment of the design of
 three-dimensional integrated circuits despite the significant progress that has recently
 been achieved in this exciting new technology. Consequently, the intention of this
 material is to cohesively integrate and present research milestones from different, yet
 interdependent, aspects of three-dimensional integrated circuit design. The foremost
 goal of the book is to propose design methodologies for 3-D circuits; methodologies
 that will effectively exploit the flourishing manufacturing diversity existing in three-
 dimensional integration. While the focal point is design techniques and methodologies,
 the material also highlights significant manufacturing strides that complete the research
 mosaic of three-dimensional integration.
 Three-dimensional or vertical integration is an exciting path to boost the performance
 and extend the capabilities of modern integrated circuits. These capabilities are inherent
 to three-dimensional integrated circuits. The former enhancement is due to the consid-
 erably shorter interconnect length in the vertical direction and the latter is due to the
 ability to combine dissimilar technologies within a multi-plane system. It is also worth
 noting that vertical integration is particularly compatible with the integrated circuit
 design process that has been developed over the past several decades. These distinctive
 characteristics make three-dimensional integration highly attractive as compared to
 other radical technological solutions that have been proposed to resolve the increas-
 ingly difficult issue of on-chip interconnect.
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