|
|
马上注册，结交更多好友，享用更多功能，让你轻松玩转社区。
您需要 登录 才可以下载或查看，没有账号？注册
x
By Xingcun Colin Tong
CRC Press
Preface
Electromagnetic compatibility (EMC) has been widely recognized as a part of electronic
design, especially since implementation of the EMC directive (89/336/EEC)
in 1992. National agencies in many countries have developed EMC standards and
regulations to minimize the problems caused by failure to deal with electromagnetic
interference (EMI). Historically, a concern about EMI can be dated back to military.
products in the 1930s. Since then great efforts have been made to develop EMI shielding
approaches. As digital devices appeared, EMI became a great concern. In the
1970s, problems associated with EMI and EMC design became an issue for products
that were beginning to be used within the commercial marketplace. EMC is now a
major factor in the design of all electrical products, and EMI shielding products have
been widely used in the military, aerospace industry, and commercial marketplaces.
With the development of EMC design and EMI shielding approaches, numerous
textbooks and articles have been published that cover all aspects of theoretical
physics related to EMC. However, comprehensive work devoted to the practicalities
of EMI shielding materials and design is rare. To meet the need in this area, this
book aims to comprehensively introduce the design guideline, materials selection,
characterization methodology, manufacturing technology, and future prospective of
EMI shielding. Chapter 1 gives the necessary overview of EMI shielding theory and
product design guideline. Chapter 2 is an extensive review of the characterization.
methodology of EMI shielding and materials used. Chapter 3 through Chapter 11
introduce particular EMI shielding materials and component designs, including
enclosures, metal-formed gaskets, conductive elastomer and flexible graphite components,
conductive foam and ventilation structures, board-level shielding materials,
composite materials and hybrid structures, absorber materials, grounding and cablelevel
shielding materials, and aerospace and nuclear shielding materials. Finally,
Chapter 12 presents a perspective of future trends in EMI shielding materials and
design.
It is a great pleasure to gratefully acknowledge the help and support I have
received from my colleagues who have contributed to my understanding of EMC
and EMI shielding approaches. |
|
/2 
eetop公众号
创芯大讲堂
创芯人才网
发表于 2008-11-14 13:35:37
楼主
