求IDTechEx 的《先进半导体封装 2024-2034：预测、技术、应用》报告

lixinyao

最好中英文的都有，感谢！
IDTechEx 的《先进半导体封装 2024-2034：预测、技术、应用》报告探索动态半导体封装领域，重点介绍 2.5D 和 3D 封装。它分析技术趋势、行业壁垒和主要参与者的进展，预测市场趋势。该报告利用 IDTechEx 在人工智能、数据中心、自动驾驶车辆、5G 和消费电子领域的专业知识，全面探讨先进半导体封装如何塑造这些领域，为行业的未来提供了宝贵的见解。

[color=rgb(70, 70, 70) !important]Exploring Advanced Semiconductor Packaging Technologies: 2.5D and 3D Insights
Semiconductor packaging has progressed from 1D PCB levels to advanced 3D hybrid bonding at the wafer level, enabling single-digit micrometer interconnecting pitches and 1000 GB/s bandwidth with high energy efficiency. Four crucial parameters guide this evolution: Power, optimizing efficiency; Performance, enhancing bandwidth and reducing communication length; Area, requiring larger space for high-performance computing chips and a smaller z-form factor for 3D integration; and Cost, consistently decreasing through material alternatives and improved manufacturing efficiency.

特雷孙

同求

gonethewind

付费报告？