Practical Guide to the Packaging of Electronics Thermal and Mechanical Design and Analysis, Third Edition

conan719 · 发表于 2022-11-2 09:40:33

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本帖最后由 conan719 于 2022-11-2 09:42 编辑

[size=13.3333px]Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems

[size=13.3333px]A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.