三星eMMC芯片datasheet

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Samsung eMMC Product family
eMMC 5.1 Specification compatibility

Table Of Contents
1.0 PRODUCT LIST..........................................................................................................................................................4
2.0 KEY FEATURES.........................................................................................................................................................4
3.0 PACKAGE CONFIGURATIONS .................................................................................................................................5
3.1 153 Ball Pin Configuration ....................................................................................................................................... 5
3.1.1 11.5mm x 13mm x 0.8mm Package Dimension [8GB /16GB] .......................................................................... 6
3.1.2 11.5mm x 13mm x 0.8mm Package Dimension [32GB] ................................................................................... 6
3.1.3 11.5mm x 13mm x 1.0mm Package Dimension [64GB] ................................................................................... 7
3.2 Product Architecture ................................................................................................................................................ 8
4.0 HS400 mode...............................................................................................................................................................9
5.0 New eMMC5.1 Features .............................................................................................................................................10
5.1 Overview.................................................................................................................................................................. 10
5.2 Command Queuing ................................................................................................................................................. 10
5.2.1 CMD Set Description......................................................................................................................................... 10
5.2.2 New Response : QSR (Queue Status Register) .............................................................................................. 10
5.2.3 Send Status : CMD13 ...................................................................................................................................... 10
5.2.4 Mechanism of CMD Queue operation............................................................................................................... 11
5.2.5 CMD Queue Register description ..................................................................................................................... 11
5.3 Enhanced Strobe Mode........................................................................................................................................... 11
5.4 RPMB Throughput improve ..................................................................................................................................... 11
5.5 Secure Write Protection........................................................................................................................................... 12
6.0 Technical Notes ..........................................................................................................................................................13
6.1 S/W Algorithm.......................................................................................................................................................... 13
6.1.1 Partition Management ....................................................................................................................................... 13
6.1.1.1 Enhanced Partition (Area) .......................................................................................................................... 13
6.1.2 Boot operation................................................................................................................................................... 13
6.1.3 User Density...................................................................................................................................................... 14
6.1.4 Auto Power Saving Mode.................................................................................................................................. 15
6.1.5 Performance...................................................................................................................................................... 15
7.0 REGISTER VALUE.....................................................................................................................................................16
7.1 OCR Register .......................................................................................................................................................... 16
7.2 CID Register ............................................................................................................................................................ 16
7.2.1 Product name table (In CID Register) ............................................................................................................... 16
7.3 CSD Register........................................................................................................................................................... 17
7.4 Extended CSD Register .......................................................................................................................................... 18
8.0 AC PARAMETER........................................................................................................................................................23
8.1 Timing Parameter .................................................................................................................................................... 23
8.2 Previous Bus Timing Parameters for DDR52 and HS200 mode are defined by JEDEC standard.......................... 23
8.3 Bus Timing Specification in HS400 mode ............................................................................................................... 24
8.3.1 HS400 Device Input Timing .............................................................................................................................. 24
8.3.2 HS400 Device Output Timing............................................................................................................................ 25
8.4 Bus signal levels...................................................................................................................................................... 26
8.4.1 Open-drain mode bus signal level..................................................................................................................... 26
8.4.2 Push-pull mode bus signal level eMMC ............................................................................................................ 26
9.0 DC PARAMETER .......................................................................................................................................................27
9.1 Active Power Consumption during operation .......................................................................................................... 27
9.2 Standby Power Consumption in auto power saving mode and standby state......................................................... 27
9.3 Sleep Power Consumption in Sleep State............................................................................................................... 27
9.4 Supply Voltage ........................................................................................................................................................ 27
9.5 Bus Signal Line Load............................................................................................................................................... 28

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