Flip chip封装的bump到PCB的寄生该怎么考虑？

husoutheast

各位前辈 ，小弟最近在做一个微波芯片，计划使用flip chip的封装形式，可是不知道该怎么考虑flip chip的bump的寄生电感、寄生电阻等的大小，在仿真的时候该怎么在电路中添加相应的器件来模拟封装，不知道有没有有经验的前辈赐教一下，感谢感谢！！

etrobert

FCBGA is very like the PCB.
except for the solder bump and BGA Ball.

You can
(a). check out the websites of the IC assembly/package suppliers for the related information.
Or, (b). by your self, do the estimation by simulation (creating the nets' traces\vias\pads..)
However, I suggest that you should take the approach (a) at first.

Then, you can get an image about the FCBGA packaging.