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发表于 2015-11-15 13:29:18
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作者简介
Aida Todri-Sanial holds a BS in electrical engineering from Bradley University, IL; an MS in electrical engineering from California State University, Long Beach, CA; and a PhD in electrical and computer engineering from the University of California, Santa Barbara. She has held visiting research positions at Cadence Design Systems, Mentor Graphics, IBM TJ Watson Research Center, and STMicroelectronics. She was a recipient of the John Bardeen Fellowship and an R&D engineer at Fermilab, IL. She is currently a research scientist at CNRS, France and a member of the Microelectronics Department at LIRMM, where she is the group leader of Integration and Design of Energy-Aware Circuits and Systems. Widely published, highly decorated, and an IEEE and ACM member, Dr. Todri-Sanial participates in several international conference committees and serves as an associate editor for IEEE TVLSI journal. She is also engaged with the EPWS and WiTEC.
Chuan Seng Tan holds a BEng in electrical engineering from the University of Malaya, Malaysia; an MEng in advanced materials from the National University of Singapore; and a PhD in electrical engineering from the Massachusetts Institute of Technology, Cambridge. He has been a research engineer with the Institute of Microelectronics, Singapore; an Applied Materials Graduate Fellow; and an intern at Intel Corporation, Oregon. He is currently an associate professor at Nanyang Technological University, Singapore, where he previously served as a Lee Kuan Yew Postdoctoral Fellow and an inaugural Nanyang Assistant Professor. Widely published, Dr. Tan participates in several international conference committees and is a member of the IEEE. He has edited three and co-authored two books, and serves as an associate editor for Elsevier Microelectronics Journal.
目录
3D INTEGRATION OVERVIEW
2.5D/3D ICs: Drivers, Technology, Applications, and Outlook
Chuan Seng Tan
Overview of Physical Design Issues for 3D-Integrated Circuits
Aida Todri-Sanial
Detailed Electrical and Reliability Study of Tapered TSVs
Tiantao Lu and Ankur Srivastava
3D Interconnect Extraction
Sung Kyu Lim
PHYSICAL DESIGN METHODS FOR 3D INTEGRATION
3D Placement and Routing
Pingqiang Zhou and Sachin S. Sapatnekar
Power and Signal Integrity Challenges in 3D Systems-on-Chip
Emre Salman
Design Methodology for TSV-Based 3D Clock Networks
Taewhan Kim and Heechun Park
Design Methodology for 3D Power Delivery Networks
Aida Todri-Sanial
RELIABILITY CONCERNS FOR 3D INTEGRATION
Live Free or Die Hard: Design for Reliability in 3D Integrated Circuits
Yu-Guang Chen, Yiyu Shi, and Shih-Chieh Chang
Thermal Modeling and Management for 3D Stacked Systems
Tiansheng Zhang, Fulya Kaplan, and Ayse K. Coskun
Exploration of the Thermal Design Space in 3D Integrated Circuits
Sumeet S. Kumar, Amir Zjajo, and Rene van Leuken
Exploration of the Thermal Design Space in 3D Integrated Circuits
Nizar Dahir, Ra’ed Al-Dujaily, Terrence Mak, and Alex Yakolev
TSV-to-Device Noise Analysis and Mitigation Techniques
Brad Gaynor, Nauman Khan, and Soha Hassoun
CAD DESIGN TOOLS AND FUTURE DIRECTIONS FOR 3D PHYSICAL DESIGN
Overview of 3D CAD Design Tools
Andy Heinig and Robert Fischbach
Design Challenges and Solutions for Monolithic 3D ICs
Sung Kyu Lim and Yiyu Shi
Design of High-Speed Interconnects for 3D/2.5D ICs without TSVs
Tony Tae-Hyoung Kim and Aung Myat Thu Linn
Challenges and Future Directions of 3D Physical Design
Johann Knechtel, Jens Lienig, and Cliff C.N. Sze |
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发表于 2015-11-15 13:28:37
