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 发表于 2008-3-21 16:20:44
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| Christoph Werner (Nokia Siemens Networks) and David Sebastio (Texas Instruments Ltd)
 
 ABSTRACT
 In recent years serial data transmission between different chips has been extended to rates of
 multi gigabits per second. We performed analog simulations with the circuit simulator HSPICE
 for the entire transmission path from the modules inside the transmitting chip to the clock-datarecovery
 modules in the receiver, including also models for the packages, striplines and
 connectors on the PCB boards.
 The influence of board layout as well as the settings of de-emphasis and equalization parameters
 has been investigated to achieve a bit error free data transmission. A variety of applications were
 studied including Serial Rapid IO links of up to 3.125 Gbps, DDR2 memory devices, and CPRI
 links of 2.5 Gbps inside mobile radio base stations.
 The chips investigated in this study include state of the art DSP, FPGA, ASIC and Memory
 devices, with encrypted HSPICE models for the transceiver modules provided by the chip
 vendors. Package and transmission lines were modeled in HSPICE using the W-model and the
 two-dimensional field solver utility.
 Signal integrity effects studied in our investigation include:
 - Setting of swing amplitude and de-emphasis in the transmitter
 - Optimized setting of equalization parameters for low and high frequency
 - Reflection and loss of signal amplitude at non perfectly terminated transmission lines
 - Jitter and distortion of clock signals and their impact on data recovery
 - Voltage drop and noise on the power supply
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