Heterogeneous Integrations

zcrf82 · 发表于 2019-4-15 21:38:32

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Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

joshuacp · 发表于 2019-4-16 09:13:15

Good.沙发。

lhyi · 发表于 2019-4-16 13:09:36

very nice, thank you

chriszbx · 发表于 2019-4-22 08:52:57

谢谢分享

yjvs · 发表于 2019-4-23 20:56:36

Good book THX LZ

tu_yjq123 · 发表于 2019-4-25 23:21:16

多谢分享

m9223016 · 发表于 2019-8-5 12:05:53

可以了解封裝產業
謝謝分享

zcrf82 · 发表于 2019-8-25 21:03:47

这书还不错

zhknpu006 · 发表于 2019-9-8 23:05:18

very nice, thank you

larson · 发表于 2020-3-6 21:13:19

谢谢分享

[资料] Heterogeneous Integrations

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