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[招聘] 【招聘】AMD内推后端PR(Physical Design)

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发表于 2015-11-26 22:44:22 | 显示全部楼层 |阅读模式

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我老板招人,需要后端经验。

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我会先跟您初步了解一下。

Job Description:
Physical design of deep sub-micron chips including block level floorplanning, place&route, cts, routing, physical verification, sta, si closure , power closure.

Qualification:
1. Master and above of EE.
2. Experience on place and routing, signal integrity, power analysis, CTS design, DFT, design rule and connectivity verification, sta.
3. Knowledgeable in all aspects of deep submicron ASIC design flow.
4. Familiar with Back-End (physical design) EDA tools.
5. Familiar with Front-End EDA tools or circuit design is a plus.
6. Familiar with Unix/Linux environment and good at scripts (tcl/perl).
7. Strong passion in achievement and career development.
8. Good English listening, writing and speaking ability.
9. Good communication skills, strong interpersonal skills and the flexibility. Dedicated, hard working and good team player.
发表于 2015-11-30 18:13:33 | 显示全部楼层
回复 1# magictracyguy


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