memory design engineer

jj_seu

Memory Design Engineer

简历发 芯得 [url=mailtoffer@hi-talent.net]offer@hi-talent.net[/url]

is working on cutting-edge embedded MemoryIP development for worldwide clients, including SRAM, RA, RF, TCAM, ROM, etc. By employing the industry leading tools,state of the art methodology, and innovative semiconductor leading technologiesranging from 32nm to 14nmand beyond, you will be participating in:

-Design full custom circuits in theembedded memory arrays

-Simulate, verify and analyze memoryfunctionality, performance and statistical margin

-Perform functional verification, characterizationand model-to-hardware correlation

-Evaluate and optimize memory architectureand methodology in cutting-edge technology

Requirements:

-ME/EE or background in related areas.

-At least 2 years industry circuit designor verification experience.

-Experience in one or more of the followingembedded or standalone memory products/circuits: SRAM, DRAM, Flash, RA, RF, TCAM, ROM, etc.

-Familiar with transistor level circuit EDAtools (Virtuoso, Spectre,HSPICE, etc.).

-Good understanding of advanced semiconductor technology process anddevice physics.

-Experience with statistical circuitanalysis and simulation is a plus.

-Good English skills, communication skills,and willingness to work with a global team. Skill in other languages is a plus.

-Good learning competency, self-motivated,and ability to work in diverse areas in a flexible and dynamic environment.

Best Regards

Jane.Jin 金娟

Principal Consultant & General Manager @ Hi-Talent Consulting Co.,Ltd.

上海芯得企业管理咨询有限公司

上海芯相会企业管理咨询有限公司

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E-Mail:         Jane-Jin@hi-talent.com

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