【江阴/上海】Staff IC Testing Engineer-美资芯片原厂

sophia_miya

Dear All ，

专业半导体行业猎头，多个芯片封装，测试类职位。有兴趣者可以联系小猎Sophia，欢迎推荐、自荐！！^^.
最好直接CV TO [url=]sophia_wu520@hotmail.com[/url]，会实时查收，有合适职位我会主动电话联系。

如下OPENING，高级职位，薪资合理涨幅可谈！


江阴/上海：Staff Testing Engineer，Global 美资芯片公司，驻场江阴封测厂，subcon管理 。
--要求至少本科10年以上芯片测试经验，熟悉NPI-量产整个流程及设备，英语要流利！

Responsibilities：
1.
Direct interface with and on-site hands-on support for assembly & test contract manufacturers on technical and quality issues
2.
Leads and provides technical support in the execution of new product introduction projects from production qual to volume production
3.
Initiates qualification and reliability builds and follow through till completion on behalf of business units.
4.
Validates new test program and new test H/W before release to production with full accountability
5.
Drives test yield improvement for new and mature products
6.
Identifies and implements value engineering activities for test cost reduction and process flow simplification
7.
Directs and coordinates activities with contract manufacturers in improving process capabilities and manufacturability
8.
Performs analyses required for material release board
9.
Supports the introduction of new tester platforms or new manufacturing technology

Mandatory Skills
1.
Proficient in written and spoken English
2.
Good knowledge of IC packaging, testing and manufacturing process technologies
3.
Product or test engineering experience in microcontrollers, microprocessors and/or non-volatile memories essential
4.
Familiar with device Qual/Cz, 8D process, 6-sigma programs, FMEA, SPC and other formal problem solving methodologies
5.
Able to apply statistical analysis skills and use statistical packages like JMP
6.
Strong communication and interpersonal skills
7.
Strong project management skills and able to work independently
8.
Test programming experience on more than 1 ATE platform advantageous
9.
Hands on knowledge of handler (esp. strip test) and knowledge of RF test is desirable
10.
Knowledge of IC design, test development tools and wafer fab process preferred
11.
Preferably having own transport to travel between Subcon sites