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[招聘] 大厂数字后端招聘北京上海成都深圳

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发表于 2021-7-16 16:22:21 | 显示全部楼层 |阅读模式

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芯片后端设计专家

岗位描述
As a member of the PD team, you will build the next generation networking SoC in advanced process. You will drive the backend flow through the entire RTL2GDS process including floor planning, P&R, timing, PI, and sign-offs. You will also conduct PPA optimization.

You responsibilities include, but not limited to:
* Build backend flow on state-of-the-art processing node
* Create SPECs for PD sign-off
* Work closely with architecture and design team to optimize PPA
* Floor planning, design synthesis, equivalence checks, partitioning, IO assignment and IP integration, CTS and power grid, P&R , timing closure, power analysis etc.
* Design and timing ECOs and sign-offs
岗位要求
BS or MS of EE, 5+ years of experience with the whole RTL2GDS process
* Understanding the state-of-the-art of processing node, custom lib and optimizations
* State-of-the-art experience with CTS and power grid planning, power integrity is a plus
* Experience with relatively large designs (>10m flops) on advanced process nodes and optimization methodology toward top performance and low power
* Understanding of DVFS, DFT, DFY, DFM is a plus

Some hands on with following tools are needed:
* Floor planning and P&R: Cadence Innovus and/or Synopsys ICC2
* Synthesis: Synopsys DC/DCG
* Formal Verification : Synopsys Formality and/or Cadence LEC
* STA: Primetime-DMSA
* PI : Apache Redhawk
* Physical Design Verification: Synopsys ICV, Mentor Calibre
* Scripting: TCL/Perl is required, Python is a plus
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