Three-Dimensional Integration and Modeling

天翼e100 · 发表于 2023-10-28 15:39:07

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This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.
Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

omnik · 发表于 2023-10-28 16:36:19

gooooooooood

im.leo · 发表于 2023-10-28 18:56:46

多谢分享多谢分享多谢分享

rnysun · 发表于 2023-10-29 09:58:23

thanks

sutaotao2001 · 发表于 2023-10-29 10:49:32

Thanks

xuleiwx · 发表于 2023-10-30 09:17:37

下载看看

lhyi · 发表于 2023-10-30 11:11:31

Thanks

amigo.change · 发表于 2023-10-31 19:59:03

dolamos · 发表于 2024-10-8 21:31:08

kan kan

dannymu · 发表于昨天 15:11

谢谢

[资料] Three-Dimensional Integration and Modeling

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