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[招聘] AMD招聘后端设计physical design 工程师

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发表于 2017-3-17 18:05:53 | 显示全部楼层 |阅读模式

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AMD招聘后端设计physical design 工程师,感兴趣的请把简历发送至maggie1.zhang@amd.com

Job Description:              

Work with globalFront-End design team and physical design team for large scale ASIC chipphysical implementation. Focus on physical design of deep sub-micron GPU chipsincluding block level (full chip) floor planning, timing closure,place&route, physical verification etc. The individual is expected to be anexpert in multiple aspects in PD areas and provide technically leadership tothe engineering team. The individual is also expected to be accountable forproject delivery.


Job Requirement:

1.
MSEE with6+ years or Bachelor with 8+ years of industrial experience in ASIC design

2.
5+ yearsor more years of experience in physical design of deep submicron digital ASICchips

3.
Hands onexperience in large scale ASIC chip physical design

4.
Knowledgeablein all aspects of deep submicron ASIC design flow

5.
Successfullygone through several complete product development cycles

6.
Demonstratestrong leadership and work well with cross-functional teams

7.
Goodlistening, writing and speaking English

8.
Goodcommunication skills, strong interpersonal skills and the flexibility

9.
Dedicated,hardworking and good team player

10.
Familiarwith Back-End (physical design) EDA tools

11.
Familiarwith Front-End EDA tools is a plus

12.
Familiarwith Unix/Linux environment and good at scripts

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