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Title: Fundamentals of Microsystems Packaging Editor: Professor Rao R. Tummala Publisher: McGraw-Hill Companies Number of pages: 921 Single package of some 12.7 MB File format: PDF All chapters are bookmarked!(Reference friendly...) Pages 882 and 883 of chapter 22 are missing! :-( Great reference book for packaging of microsystems, including IC, MEMS, etc.
Fundamentals of Microsystems Packaging.pdf
(12.39 MB, 下载次数: 1416 )
List of chapters (Table of Contents) 1 - Introduction to Microsystems Packaging
2 - The Role of Packaging in Microelectronics
3 - The Role of Packaging in Microsystems
4 - Fundamentals of Electrical Package Design
5 - Fundamentals of Design for Reliability
6 - Fundamentals of Thermal Management
7 - Fundamentals of Single Chip Packaging
8 - Fundamentals of Multichip Packaging
9 - Fundamentals of IC Assembly
10 - Fundamentals of Wafer Level Packaging
11 - Fundamentals of Passives
12 - Fundamentals of Optoelectronics
13 - Fundamentals of RF Packaging
14 - Fundamentals of MEMS Packaging
15 - Fundamentals of Sealing and Encapsulation
16 - Fundamentals of System Level PWB Technologies
17 - Fundamentals of Board Assembly
18 - Fundamentals of Packaging Materials and Processes
19 - Fundamentals of Electrical Testing
20 - Fundamentals of Package Manufacturing
21 - Fundamentals of Microsystems Design for Environment
22 - Fundamentals of Microsystems Reliability | 
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发表于 2012-3-28 22:51:04
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