【Springer 2010 新书】RF and Microwave Microelectronics Packaging

lotusky · 发表于 2009-12-11 23:28:33

马上注册，结交更多好友，享用更多功能，让你轻松玩转社区。

您需要登录才可以下载或查看，没有账号？注册

×

登录/注册后可看大图

[size=120%]RF and Microwave Microelectronics Packaging
By Ken Kuang, Franklin Kim, Sean S. Cahill

Publisher: Springer
Number Of Pages: 285
Publication Date: 2009-11-17
ISBN-10 / ASIN: 1441909834
ISBN-13 / EAN: 9781441909831

Product Description:

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

goodlvjie2001 · 发表于 2009-12-11 23:35:15

好东西确实不少啊

myota · 发表于 2009-12-11 23:43:08

kankan!

hgdllt · 发表于 2009-12-11 23:49:28

hao shu

bing131 · 发表于 2009-12-12 00:13:04

刚好最近作封装，谢了

bing131 · 发表于 2009-12-12 00:18:38

再次感谢楼主

fpga_sh · 发表于 2009-12-12 02:11:55

谢谢楼主

fpga_sh · 发表于 2009-12-12 02:14:30

谢谢楼主

hezudao · 发表于 2009-12-12 06:59:26

ding duo xie

hezudao · 发表于 2009-12-12 07:00:32

ding ding a

账号		自动登录	找回密码
密码			注册

【Springer 2010 新书】RF and Microwave Microelectronics Packaging

马上注册，结交更多好友，享用更多功能，让你轻松玩转社区。

相关帖子

浏览过的版块

站长推荐 /2