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发表于 2023-3-20 01:44:56
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2.5D / 3D are packaging methodology for including multiple IC inside the same package. In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for shortest interconnect and smallest package footprint.
In recent years, 2.5D & 3D has gained momentum as an ideal chiplet integration* platform due to their merits on achieving extremely high packaging density and high energy efficiency.
ASE is one of the pioneers in 2.5D/3D packaging technology and has successfully launched world’s first mass production of 2.5D IC package equipped with High Bandwidth Memory (HBM).
Benefits of 2.5D & 3D IC Packaging
Our 2.5D/3D IC packaging solution provides the benefit of integrating GPU, CPU and memory along with decoupling capacitor. Si interposer with TSV (Through Silicon Via) can be used as a platform to bridge fine pitch capability gap between assembly substrate and integrated circuit board. It also helps to keep pad pitch scaling path without being limited by assembly substrate technology.
Key advantages of applying 2.5D & 3D IC Packaging:
Ultra high routing density (L/S: 0.4/0.4µm)
Ultra high I/O density (> 400 µbumps/mm²) & I/O pitch scalability
Homogeneous / heterogeneous memory, power and/or optics integration
Interposer capable of embedding decoupling capacitor or active devices feasible
Excellent package reliability to meet automotive requirements |
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