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[招聘] 【招聘】上海张江 现招SoC design/verification/flow Engineer

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发表于 2019-1-10 09:34:37 | 显示全部楼层 |阅读模式

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本帖最后由 小芯 于 2020-1-6 09:48 编辑

坐标上海张江,岗位和公司介绍如下,欢迎有兴趣人士投递简历至 Amanda.Wu@verisilicon.com

,并标明意向岗位。

岗位介绍

1.Engineer/Sr. Engineer of SoC Design   前端设计工程师/高级工程师

2.Sr.Engineer/Staff Engineer of SoC Verification 前端验证高级工程师/资深工程师

3.Engineer/Sr.Engineer of SoC FE Flow  前端流程工程师/高级工程师


1.Engineer/Sr. Engineer of SoC Design

Responsibilities:

1.Play animportant role in defining chip spec and devising chip architecture.

2.Develop challenging modules including modulespec definition, macro architecture design, RTL coding, simulation andsynthesis.

3.Carry out chiplevel verification or chip integration/implementation.

4.Help juniorengineers to solve technical issues.

5.Supportcustomers regarding chip applications.

Requirements:

1.Bachelor degreeor above in EE, 3+ years experience.

2.Goodknowledge of some of the following general IP: cpu/dsp, AMBA, DDR/SDRAM, video(HEVC, MIPI…), parallel/serial peripheral module, DMA, interrupt, timer, GPIO.

3.Good skill inthe field of digital circuit design, whole digital design flow and EDA tools;

4.Key member inat least one successfully silicon proven challenging project.

5.Fluent in bothEnglish and Chinese.

6.Self motivated,good communication skill and team work spirit.


2.Sr. Engineer/Staff Engineer of SoC Verification

Responsibilities:

1.Understandingthe expected functionality of designs.

2.Developingtesting and regression plans.

3.Designing anddeveloping verification environment.

4.Running RTL andgate-level simulations/regression.

5.Code/functionalcoverage development, analysis and closure.

Requirements:

1.Minimum of 3 years design/verificationexperience (test plan, test bench, assertions, debugging designs, code coverageetc.).

2.Knowledge inasic/FPGA design process and verification tools/env ( UVM/OVM…)

3.Familiar withdesign and verification languages (verilog, System Verilog, SVA etc.).

4.Scripting andautomation skills (tcl, perl, makefile etc) a plus.

5.Familiar withC/C++.

6.Knowledge of DDR/Video/arm/USB/PCIE , Low PowerVerification with UPF and design experience is a plus.

7.Experiencein CPU/DSP verification, including test plan and test bench development, testcase development and test coverage assessment. and Knowledge of computerarchitecture and micro-architecture (pipeline, out-of-order, cache) is a plus.

8.Additional qualifications include: Good ICverification skills and basic knowledge of logic or circuit design, goodcommunication and problem solving skills.

9.Independent andself-managing.


3.Engineer/Sr.Engineer of SoC FE Flow

Responsibilities:

1.Comprehend the SoC clock structure and workingmode and prepare the SDC file for SoC design.

2.Prepare the DFTplan for the SoC design.

3.SCAN/MBIST/BSD insertion and synthesizemethodology for Flatten / Hierarchical design.

4.Pre/Postsimulation for test patterns.

5.Cooperate withtiming engineer for timing signoff (STA).

6.Analog IP testimplementation and simulation.

7.Support ATE engineer for chip testing debug, andanalyze ATE log file to locate root cause of failure.

8.Formal check ofRTL and netlist.

Requirements:

1.Bachelor'sdegree or above, major in EE, CS or relevant.

2.Above 5years work experience to the one withBachelor's degree and above 3years with Master's degree is required for SeniorEngineer position.

3.Skilled in SoCPPA, better for low power design.

4.Improve lowtest coverage to achieve higher coverage.

5.Skilled incsh/perl/tcl scripts.

6.Be familiarwith concept of SoC and P&R physical implementation.

7.Fluent in bothEnglish and Chinese.

8.Good team workspirit.





 楼主| 发表于 2019-1-11 11:32:16 | 显示全部楼层
**公司介绍:

芯原成立于2001年,总部位于中国上海,目前在全球已有超过700名员工。在全球共设有
5个设计研发中心和9个销售和客户支持办事处。

芯原股份有限公司(芯原)是一家芯片设计平台即服务(Silicon Platform as a Service,SiPaaS)提供商,为包含移动互联设备、数据中心、物联网(IoT)、汽车、工业和医疗设备在内的广泛终端市场提供全面的系统级芯片(SoC)和系统级封装(SiP)解决方案。芯原的机器学习和人工智能技术已经全面布局智慧设备的未来发展。基于SiPaaS服务理念,芯原助力客户在设计和研发阶段领先一步,从而专注于差异化等核心竞争优势。芯原一站式端到端的解决方案则能够在短时间内打造出从定义到测试封装完成的半导体产品。宽泛灵活的SiPaaS解决方案为包含新兴和成熟半导体厂商、原始设备制造商(OEMs)、原始设计制造商(ODMs),以及大型互联网和云平台提供商在内的各种客户提供高效经济的半导体产品替代解决方案。

芯原的从摄像头输入到显示/视频输出的像素处理平台由高保真 ISP,支持机器学习加速的嵌入式视觉图像处理器(VIP),Vivante低功耗GPU和高性能GPGPU,Hantro极清视频编解码器,以及支持多种接口标准的显示控制器组成,以上产品可无缝协同工作以提供最优的PPA(性能、功耗和面积)。此外,基于芯原ZSP(数字信号处理器核)技术的高清音频/语音平台和支持低功耗蓝牙(BLE)、Wi-Fi、NB-IoT和5G技术的多频多模无线基带平台为极低功耗和极高性能应用提供了可伸缩的架构。芯原增值的混合信号IP组合则可打造支持语音、手势和触摸界面的高能效自然用户界面(NUI)平台。
 楼主| 发表于 2019-1-14 13:30:29 | 显示全部楼层
岗位介绍
1.Engineer/Sr. Engineer of SoC Design   前端设计工程师/高级工程师
2.Sr.Engineer/Staff Engineer of SoC Verification 前端验证高级工程师/资深工程师
3.Engineer/Sr.Engineer of SoC FE Flow  前端流程工程师/高级工程师

坐标上海张江,岗位和公司介绍如下,欢迎有兴趣人士投递简历至 Amanda.Wu@verisilicon.com
,并标明意向岗位。
 楼主| 发表于 2019-1-15 10:06:48 | 显示全部楼层
岗位
1.Engineer/Sr. Engineer of SoC Design   前端设计工程师/高级工程师
2.Sr.Engineer/Staff Engineer of SoC Verification 前端验证高级工程师/资深工程师
3.Engineer/Sr.Engineer of SoC FE Flow  前端流程工程师/高级工程师

坐标上海张江,岗位和公司介绍如下,欢迎有兴趣人士投递简历至 Amanda.Wu@verisilicon.com
,并标明意向岗位。
 楼主| 发表于 2019-1-21 09:51:26 | 显示全部楼层
岗位
1.Engineer/Sr. Engineer of SoC Design   前端设计工程师/高级工程师
2.Sr.Engineer/Staff Engineer of SoC Verification 前端验证高级工程师/资深工程师
3.Engineer/Sr.Engineer of SoC FE Flow  前端流程工程师/高级工程师

坐标上海张江,岗位和公司介绍如下,欢迎有兴趣人士投递简历至 Amanda.Wu@verisilicon.com
,并标明意向岗位。
 楼主| 发表于 2019-1-29 09:34:20 | 显示全部楼层
Base 上海,欢迎自投或者推荐简历到邮箱:hr.resume@verisilicon.com
 楼主| 发表于 2019-1-31 15:26:12 | 显示全部楼层
Base 上海,欢迎自投或者推荐简历到邮箱:hr.resume@verisilicon.com
 楼主| 发表于 2019-2-11 17:45:29 | 显示全部楼层
岗位介绍
1.Engineer/Sr. Engineer of SoC Design   前端设计工程师/高级工程师
2.Sr.Engineer/Staff Engineer of SoC Verification 前端验证高级工程师/资深工程师
3.Engineer/Sr.Engineer of SoC FE Flow  前端流程工程师/高级工程师

坐标上海张江,岗位和公司介绍如下,欢迎有兴趣人士投递简历至 Amanda.Wu@verisilicon.com
,并标明意向岗位
 楼主| 发表于 2019-2-13 09:24:01 | 显示全部楼层
欢迎有兴趣人士投递简历至 Amanda.Wu@verisilicon.com,并标明意向岗位
 楼主| 发表于 2019-2-13 09:24:54 | 显示全部楼层
欢迎有兴趣人士投递简历至 Amanda.Wu@verisilicon.com,并标明意向岗位
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