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[资料] ESD protection and IO design (Michael_Stockinger)

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发表于 2018-11-9 11:33:38 | 显示全部楼层 |阅读模式
本帖最后由 test_account 于 2018-11-13 14:53 编辑

ESD Protection and I/O Design (3 credits) DD201

Instructor: Michael Stockinger

This tutorial is intended to provide the attendees with the tools to take a device and circuit level understanding of ESD protection methods and implement them in in I/O designs for CMOS bulk technologies. Beginning with a review of common ESD protection strategies, this course will Focus more directly on how to build ESD-robust I/O cells and how to integrate them on a full chip. The tutorial will cover various types of I/O pads including analog, RF and digital pads. Different types of ESD protection strategies and Their usage in I/O pad cells will be described, for example rail clamp, self-contained, and SCR based protection schemes. This course will also discuss the decisions and challenges which ESD and I/O designers typically face when designing I/O Pads.More complex ESD solutions will also be described such as stacked rail clamps, ghost rails, and protecting signals that can swing below ground or above the supply. Finally, this tutorial will touch on various supply schemes including multiple power domains and isolated grounding schemes. Will end with discussing pad ring construction aspects for both wire-bond and flip-chip packages.

DD201.pdf (4.83 MB, 下载次数: 93)

发表于 2018-11-12 19:56:54 | 显示全部楼层
楼主书呢?
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发表于 2018-11-24 09:28:52 | 显示全部楼层
谢谢分享
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发表于 2018-11-27 16:52:34 | 显示全部楼层
谢谢分享!
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发表于 2018-11-30 16:47:03 | 显示全部楼层
谢谢分享
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发表于 2019-1-11 19:51:36 | 显示全部楼层
谢谢分享
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发表于 2019-1-18 19:48:28 | 显示全部楼层
A good tutorial
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发表于 2019-1-26 15:25:41 | 显示全部楼层
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