IO ESD 版图设计中contact数量 和metal宽度要求依据是啥，不借啊，求大神指点

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请教各位，在ESD设计中会有contact数量和via数量要求具有100mA的电流能力（如图1），金属宽度要求20um，顶层金属要求3um（如图2），请问依据是什么呢？不解。
请大神留步指教，小女子不胜感激！

1、
Contacts and Vias should be used as many as possible, and at leastcapable of bearing 100mA DC current.

2、
Total width of each individual intermetal (M1~M8) lines of thenearest current path between ESD devices and bonding and bonding pad. (W2≥20um)

ps: M1~M8 current density is 1.9mA/um.